Senior Semiconductor Packaging Process Engineer

Stcorp; Nijmegen; Remote; EUR 90,000 - 130,000; Full time

Job summary

AtS&T in Nijmegen seeks a Senior Researcher/Process Engineer to lead development of advanced die attach solutions and packaging for power electronics. You will manage DoE studies, analyze results, and drive process improvements in a multidisciplinary team with international partners.

You will design and optimize assembly processes, tooling, and packaging components, while supervising students and junior engineers. Strong English communication is essential for customer interactions.

Qualifications

• Minimum of 8 years of experience in semiconductor packaging development.
• Extensive knowledge of semiconductor assembly and packaging technologies.
• Experience with packaging and tooling design using 2D and 3D design software like AutoCAD and/or SolidWorks.
• Proven DoE methodologies, data analysis, and experimental process development.
• Experience with advanced assembly, die attach and interconnection technologies.
• Knowledge of Ag and Cu sintering processes is highly desirable.
• Hands-on mentality and the ability to independently plan and execute technical work.
• Strong communication skills and the ability to present technical results in English to industrial customers.

Responsibilities

• Defining and optimizing assembly processes and production flows for new die attach technologies, including developing processes for thin die assembly.
• Designing packages and packaging components for power electronics, e.g. lead frames and clips.
• Designing tooling for packaging manufacturing and assembly, including lead frame tooling and vacuum pick-up tools.
• Setting up, executing and analysing DoE for materials and process development.
• Analysing experimental results and translating findings into process improvements and technological recommendations.
• Programming and operating advanced packaging and assembly equipment.
• Reporting technical progress and results to customers and project stakeholders.
• Technical supervision of students and junior engineers.

Skills

DoE

Data analysis

Experimental development

English presentation

Hands-on mentality

Independent work

Strong communication

Tools

AutoCAD

SolidWorks

Job description

AtS&T in Nijmegen seeks a Senior Researcher/Process Engineer to lead development of advanced die attach solutions and packaging for power electronics. You will manage DoE studies, analyze results, and drive process improvements in a multidisciplinary team with international partners.

You will design and optimize assembly processes, tooling, and packaging components, while supervising students and junior engineers. Strong English communication is essential for customer interactions.