Global Lead, Advanced Semiconductor Packaging

NXP Semiconductors NV

Nijmegen

On-site

EUR 90,000 - 150,000

Full time

14 days+

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Job summary

NXP Semiconductors NV is seeking an experienced Semiconductor Packaging Engineer to lead packaging solutions for new products and technologies across multiple business lines in the Netherlands. You will define architectures, materials, and processes to meet reliability and cost targets, while guiding cross-functional teams through complex programs.

The role involves monitoring trends in advanced packaging, ensuring deliverables for NPIs and NTIs, and may include international travel to assembly

Qualifications

BS or higher in Mechanical Engineering, Materials Science, Chemical Engineering, Electrical Engineering, or related field.
Deep knowledge of IC package families (QFP, QFN, BGA, FCBGA, FCCSP, WLCSP, FOWLP, FOPLP/PLP, SiP/modules).
Experience leading cross-functional technical projects across multiple groups.

Responsibilities

Define package architectures, materials, structures, and assembly process flows meeting reliability, performance, manufacturability, and cost.
Drive cross-functional technical programs with Marketing, Business Lines, Package Design, Product Engineering, Silicon Design, Simulation, Test, Quality, Reliability, Manufacturing, OSATs, suppliers, and partners.
Monitor industry trends in advanced packaging (PLP, power packaging) and define roadmaps.
Ensure NPI/NTI deliverables including feasibility, design, prototype builds, qualification, release, and ramp.
May require international travel to assembly sites, OSATs, suppliers, and partners.