Senior Process Engineer - Semiconductor Packaging

Science [&] Technology AS; Nijmegen; Remote; EUR 90,000 - 130,000; Full time

Job summary

AtS&T in Nijmegen seeks a Senior Researcher/Process Engineer to lead development of advanced die attach solutions and packaging for power electronics. You will manage DoE studies, analyze results, and drive process improvements in a multidisciplinary team with international partners.

You will design and optimize assembly processes, tooling, and packaging components, while supervising students and junior engineers. Strong English communication is essential for customer interactions.

Qualifications

• Minimum of 8 years of experience in semiconductor packaging development.
• Extensive knowledge of semiconductor assembly and packaging technologies.
• Experience with packaging and tooling design using 2D and 3D design software like AutoCAD and/or SolidWorks.
• Proven DoE methodologies, data analysis, and experimental process development.
• Experience with advanced assembly, die attach and interconnection technologies.
• Knowledge of Ag and Cu sintering processes is highly desirable.
• Hands-on mentality and the ability to independently plan and execute technical work.
• Strong communication skills and the ability to present technical results in English to industrial customers.

Responsibilities

• Defining and optimizing assembly processes and production flows for new die attach technologies, including developing processes for thin die assembly.
• Designing packages and packaging components for power electronics, e.g. lead frames and clips.
• Designing tooling for packaging manufacturing and assembly, including lead frame tooling and vacuum pick-up tools.
• Setting up, executing and analysing DoE for materials and process development.
• Analysing experimental results and translating findings into process improvements and technological recommendations.
• Programming and operating advanced packaging and assembly equipment.
• Reporting technical progress and results to customers and project stakeholders.
• Technical supervision of students and junior engineers.

Skills

DoE

Data analysis

Experimental development

English presentation

Hands-on mentality

Independent work

Strong communication

Tools

AutoCAD

SolidWorks

Job description

Senior Process Engineer - Semiconductor Packaging

Full time

Senior

About thisjob

We are currently looking for a Senior Researcher/Process Engineerto join theteam in Nijmegen.

As a Senior Process Engineer, you work at the intersection of packaging design, process development, materials science and semiconductor assembly technologies. You are actively involved in the entire development cycle of advanced die attach solutions and new packages for power electronics, from design and realization to experimental validation and characterization. You collaborate directly with industrial partners and customers to translate technology concepts into manufacturable products. You lead the design and experimental work in multiple customer and internal research projects and are part of a multidisciplinary and international team.

Senior Researcher/Process Engineer - Semicon

Main responsibilities

• Defining and optimizing assembly processes and production flows for new die attach technologies, including developing processes for thin die assembly (50 µm and smaller)
• Designing packages and packaging components for power electronics, e.g. lead frames and clips
• Designing tooling for packaging manufacturing and assembly, including lead frame tooling, vacuum pick-up tools and other product-specific fixtures
• Setting up, executing and analysing Design of Experiments (DoE) for materials and process development
• Analysing experimental results and translating findings into process improvements and technological recommendations
• Programming and operating advanced packaging and assembly equipment
• Reporting technical progress and results to customers and project stakeholders
• Technical supervision of students and junior engineers

Requirements

• Minimum of 8 years of experience in semiconductor packaging development
• Extensive knowledge of semiconductor assembly and packaging technologies
• Experience with packaging and tooling design using 2D and 3D design software like AutoCAD and/or SolidWorks
• Proven experience with DoE methodologies, data analysis, and experimental process development
• Experience with advanced assembly, die attach and interconnection technologies
• Knowledge of Ag and Cu sintering processes is highly desirable
• A hands-on mentality and the ability to independently plan and execute technical work
• Strong communication skills and the ability to present technical results in English to industrial customers and partners

Please note that if you do not hear back from us within 10 days of your application, you may assume that we have selected another candidate we would like to interview for this position. We do our best to get back to you individually, however, due to a high volume of responses, it can be that we have not been able to reject your application in person.

We kindly request that recruitment agencies do not contact us regarding this vacancy. We are not seeking assistance and will not be liable for any fees or charges associated with unsolicited CVs or candidate introductions. Any candidates submitted by agencies without prior written agreement will be considered our direct applicants and may be employed without obligation or fee.

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