RF/mmWave Package Design Engineer

NXP Semiconductors NV; Nijmegen; On-site; EUR 90,000 - 130,000; Full time

Benefits offered by this job

Restaurant nearby

Job summary

NXP Semiconductors NV is seeking a Senior Package Design Engineer in Nijmegen to lead advanced semiconductor package design across mixed-signal, RF, and mmWave products. You will drive architecture, die-package co-design, layout, and reliability optimizations working with SoC designers, OSATs, and suppliers.

Responsibilities include coordinating with simulation teams, documenting design rules, and ensuring manufacturability and cost objectives are met while delivering robust, high-performance

Qualifications

• Bachelor's or Master's degree in Electrical, Mechanical, Materials Engineering, or equivalent.
• Five+ years direct experience designing flip chip and wire-bond substrate-based and WLCSP/FOWLP semiconductor packages.
• Expert proficiency with Cadence Allegro Package Designer (APD) and AutoCAD required.
• Knowledge of die-package-PCB co-design methodologies desired.

Responsibilities

• Responsible for all aspects of package design from concept through best in class solution with optimal cost, manufacturability, performance and reliability.
• Utilize various industry standard die / package co-design and layout tools for design.
• Participate in die/package/PCB codesign activities, supporting critical signal paths and routing implementation.
• Design and optimize package structures for RF and mmWave applications with controlled-impedance routing and shielding.
• Collaborate with simulation engineers to evaluate electrical performance and implement design improvements.
• Support package design reviews, manufacturability assessments and release documentation.
• Partner with assembly sites, OSATs, substrate suppliers, and cross-functional teams to deliver robust, manufacturable package solutions.
• Provide technical guidance on package architecture, substrate technologies and RF package implementations.

Skills

Flip chip design

Wire-bond substrates

WLCSP/FOWLP

PISI & high-speed routing

Impedance-controlled interconnect

Leadership & ownership

Education

Electrical/Mechanical/Materials Eng (BSc/MSc)

Tools

Cadence Allegro APD

AutoCAD

Job description

NXP Semiconductors NV is seeking a Senior Package Design Engineer in Nijmegen to lead advanced semiconductor package design across mixed-signal, RF, and mmWave products. You will drive architecture, die-package co-design, layout, and reliability optimizations working with SoC designers, OSATs, and suppliers.

Responsibilities include coordinating with simulation teams, documenting design rules, and ensuring manufacturability and cost objectives are met while delivering robust, high-performance