RF/mmWave Package Design Engineer

NXP Semiconductors NV; Nijmegen; On-site; EUR 85,000 - 125,000; Full time

Job summary

NXP Semiconductors NV in Nijmegen seeks an experienced Senior Package Design Engineer to lead advanced semiconductor package design for RF, mmWave, and mixed-signal applications across NR and Automotive lines. You will drive die-package-PCB codesign, optimize layouts, and ensure manufacturability and reliability from concept to release.

The role requires 5+ years in flip-chip/WLCSP packaging, proficiency in APD and AutoCAD, and strong PISI knowledge.

Qualifications

• Five plus years direct experience designing flip chip and wire-bond substrate-based and WLCSP/FOWLP semiconductor packages.
• Expert proficiency with Cadence Allegro Package Designer (APD) and AutoCAD required.
• Experience with die-package-PCB codesign methodologies desired.
• Knowledge of Power Integrity and Signal Integrity (PISI) and high-speed signal routing, differential pair implementation, return-path management, and impedance-controlled interconnect design a plus.
• Strong understanding of substrate technologies including design rules as well as Geometric Dimensioning and Tolerancing.
• Experience with or extensive exposure to primarily analog SoC design prefrred.

Responsibilities

• Design package from concept through best in class solution with optimal cost, manufacturability, performance and reliability.
• Utilize various industry standard die / package co-design and layout tools for design.
• Participate in die/package/PCB codesign activities, supporting critical signal paths, package architecture, floorplanning, bump maps, stackups, and routing implementation.
• Design and optimize package structures for RF and mmWave applications, including controlled-impedance routing, grounding, shielding, and signal-launch structures.
• Collaborate with simulation engineers to evaluate electrical performance, SI/PI, EM behavior, and implement design improvements.
• Support package design reviews, manufacturability assessments, design-rule compliance, and release documentation.
• Partner with assembly sites, OSATs, substrate suppliers, and cross-functional teams to deliver robust, manufacturable package solutions.
• Provide technical guidance on package architecture, substrate technologies, assembly processes, and RF package implementation.

Skills

High-speed signal routing

Impedance-controlled interconnect

Return-path management

Geometric Dimensioning and Tolerancing

Analog SoC design exposure

Education

Bachelor's or Master's degree in Electrical, Mechanical, Materials Engineering, or equivalent

Tools

Cadence Allegro Package Designer (APD)

AutoCAD

Job description

NXP Semiconductors NV in Nijmegen seeks an experienced Senior Package Design Engineer to lead advanced semiconductor package design for RF, mmWave, and mixed-signal applications across NR and Automotive lines. You will drive die-package-PCB codesign, optimize layouts, and ensure manufacturability and reliability from concept to release.

The role requires 5+ years in flip-chip/WLCSP packaging, proficiency in APD and AutoCAD, and strong PISI knowledge.