Advanced RF/mmWave Package Design Engineer

NXP Semiconductors; Nijmegen; On-site; EUR 90,000 - 125,000; Full time

Job summary

The Package Innovation (PI) group at NXP Semiconductors in the Netherlands is seeking an experienced Package Design Engineer to advance advanced semiconductor packaging solutions across NR and Automotive lines. You will drive die-package architecture, layout, and co-design with SoC teams, OSATs and suppliers to meet electrical, thermal, mechanical and cost targets.

Responsibilities include design-rule compliance, manufacturability optimization and technical documentation, collaborating in a

Qualifications

• Five plus years direct experience designing flip chip and wire-bond substrate-based and WLCSP/FOWLP semiconductor packages.
• Expert proficiency with Cadence Allegro APD and AutoCAD required.
• Knowledge of Power Integrity and Signal Integrity (PISI) and high-speed signal routing, differential pair implementation, return-path management, and impedance-controlled interconnect design.

Responsibilities

• Design package solutions from concept to manufacturable final product.
• Support die/package/PCB co-design activities and critical signal paths.
• Design and optimize package structures for RF and mmWave applications, including controlled-impedance routing, grounding, shielding, and signal-launch structures.
• Collaborate with simulation engineers to evaluate electrical performance, SI/PI, EM behavior, and implement design improvements.
• Support package design reviews, manufacturability assessments, design-rule compliance, and release documentation.
• Partner with assembly sites, OSATs, substrate suppliers, and cross-functional teams to deliver robust, manufacturable package solutions.

Skills

Power integrity

Signal integrity

RF/mmWave design

Die-package co-design

High-speed routing

Technical leadership

Education

Bachelor's or Master's degree in Electrical, Mechanical, or Materials Engineering

Tools

Cadence Allegro APD

AutoCAD

PCB co-design tools

Job description

The Package Innovation (PI) group at NXP Semiconductors in the Netherlands is seeking an experienced Package Design Engineer to advance advanced semiconductor packaging solutions across NR and Automotive lines. You will drive die-package architecture, layout, and co-design with SoC teams, OSATs and suppliers to meet electrical, thermal, mechanical and cost targets.

Responsibilities include design-rule compliance, manufacturability optimization and technical documentation, collaborating in a