Lead IC Package Designer - Substrate & Co-Design Expert

NXP Semiconductors NV; Gelderland; Presencial; EUR 90.000 - 130.000; Jornada completa

Descripción de la vacante

NXP Semiconductors NV is seeking a Package Design Engineer to join a geographically distributed team focused on advanced substrate-based packages. You will drive layout from concept to production, coordinating with product engineering, IC design, and suppliers to ensure performance, cost and reliability targets are met.

Building on deep expertise with WLP/Flip-Chip PBGA and related tools, you will shape the design flow, collaborate across teams, and implement improvements to achieve first

Formación

• Extensive experience in leading edge substrate-based package design (Wire-Bond/Flip Chip PBGA).
• Proficient with Cadence APD SIP, Allegro and AutoCAD for layout and tooling.
• Experience with die-to-package co-design and related tools (Virtuoso/Innovus/ICC2).
• Familiar with HDI/build-up, coreless and mechanical substrate technologies.
• Able to collaborate across global teams and suppliers.
• Capable of driving design flow improvements and tool changes.
• Working knowledge of die/package PCB-level simulation and parasitic extraction tools is a plus.

Responsabilidades

• Lead package layout design from definition through co-design to final production.
• Collaborate with product engineering, IC design, and suppliers to meet timelines.
• Develop and maintain EDA tool strategy and design flow methodologies.
• Implement changes to improve design efficiency and cross-functional alignment.

Conocimientos

Package design expertise

Cadence APD SIP

Allegro/AutoCAD

Die-to-package co-design

Cross-functional collaboration

EDA tool strategy

Interpersonal skills

Design flow improvements

Electrical simulation basics

Herramientas

Virtuoso

Innovus

ICC2

HFSS

Apache

Clarity

Sigrity

Momentum

Descripción del empleo

NXP Semiconductors NV is seeking a Package Design Engineer to join a geographically distributed team focused on advanced substrate-based packages. You will drive layout from concept to production, coordinating with product engineering, IC design, and suppliers to ensure performance, cost and reliability targets are met.

Building on deep expertise with WLP/Flip-Chip PBGA and related tools, you will shape the design flow, collaborate across teams, and implement improvements to achieve first