Advanced RF/mmWave Package Design Engineer

NXP Semiconductors NV; Eindhoven; On-site; EUR 90,000 - 120,000; Full time

Job summary

NXP Semiconductors NV is seeking a Package Design Engineer to lead advanced semiconductor package design for RF, mmWave, and mixed-signal products. You will drive architecture development, die-package co-design, and layout to ensure manufacturability and reliability while hitting cost targets.

You will collaborate with BL partners, SoC designers, and global suppliers, applying Cadence APD and AutoCAD tools to optimize signal and power integrity and high-speed routing.

Qualifications

• Degree in Electrical, Mechanical, Materials Engineering or equivalent.
• 5+ years designing flip chip, wire-bond and WLCSP/FOWLP packages.
• Experience with Cadence APD and AutoCAD tooling.
• Experience with die-package-PCB co-design methodologies.
• Knowledge of Power Integrity and Signal Integrity for high-speed routing.
• Understanding of substrate technologies and design rules.
• Experience with analog SoC design is a plus.

Responsibilities

• Responsible for all aspects of package design from concept through best-in-class solution with optimal cost, manufacturability, performance and reliability.
• Utilize various industry standard die/package co-design and layout tools for design.
• Participate in die/package/PCB co-design activities, supporting critical signal paths, package architecture, floorplanning, bump maps, stackups, and routing implementation.
• Design and optimize package structures for RF and mmWave applications, including controlled-impedance routing, grounding, shielding, and signal-launch structures.
• Collaborate with simulation engineers to evaluate electrical performance, SI/PI, EM behavior, and implement design improvements.
• Support package design reviews, manufacturability assessments, design-rule compliance, and release documentation.
• Partner with assembly sites, OSATs, substrate suppliers, and cross-functional teams to deliver robust, manufacturable package solutions.
• Provide technical guidance on package architecture, substrate technologies, assembly processes, and RF package implementation.

Skills

RF design

Die-package co-design

Signal integrity

Power integrity

Technical leadership

Education

Bachelor's or Master's in Electrical/Mechanical/Materials Engineering

Tools

Cadence Allegro Package Designer (APD)

AutoCAD

Job description

NXP Semiconductors NV is seeking a Package Design Engineer to lead advanced semiconductor package design for RF, mmWave, and mixed-signal products. You will drive architecture development, die-package co-design, and layout to ensure manufacturability and reliability while hitting cost targets.

You will collaborate with BL partners, SoC designers, and global suppliers, applying Cadence APD and AutoCAD tools to optimize signal and power integrity and high-speed routing.