Quantum Packaging Lead — Flip-Chip & Qubit Tech

Entangled Future; Delft; Hybrid; EUR 110,000 - 140,000; Full time

Benefits offered by this job

Holiday allowance 8%

Pension plan

Hybrid work

Job summary

QuantWare in Delft is seeking an Advanced Packaging Lead to steer the development of back-end fabrication and assembly technologies for quantum processors, focusing on flip chip bonding, contact reliability, and manufacturability within our architecture chip stack.

You will coordinate integration plans with cross-functional teams, establish scalable procedures, and drive issues resolution to meet performance targets in a high-speed, high-trust environment.

Qualifications

• Minimum 4+ years in chip assembly development in deep-tech or low-volume tech.
• Hands-on back-end process-flow development with UBM, hard-stops, bumps and detachable contacts/MEMS.
• Background in superconducting qubits is a significant plus.
• Physics or related field; PhD is a plus.

Responsibilities

• Plan and lead development of back-end fabrication and assembly technologies for quantum processors.
• Develop and coordinate integration test plans with cross-functional teams.
• Lead the definition and formalisation of assembly-centric fabrication and process development.
• Establish scalable, well-documented integration procedures to support system growth.
• Investigate and resolve integration issues ensuring alignment with specs and targets.

Skills

Flip chip

Back-end process-flow

Contacts reliability

Quantum hardware

Education

Physics or related field (PhD preferred)

Tools

UBM

Hard-stops

Bumps

MEMS / detachable contacts

Job description

QuantWare in Delft is seeking an Advanced Packaging Lead to steer the development of back-end fabrication and assembly technologies for quantum processors, focusing on flip chip bonding, contact reliability, and manufacturability within our architecture chip stack.

You will coordinate integration plans with cross-functional teams, establish scalable procedures, and drive issues resolution to meet performance targets in a high-speed, high-trust environment.