Lead Quantum Packaging Engineer - Flip-Chip Assembly

QuantWare BV; Netherlands; Hybrid; EUR 110,000 - 170,000; Full time

Benefits offered by this job

Competitive salary

Pension plan with partner and dependec

Hybrid setup with flexible time off

Investment in L&D and personal growth

Team events and offsites

Job summary

QuantWare BV is advancing the frontiers of quantum processors using our VIO™ architecture. We are seeking an Advanced Packaging Lead to steer back-end fabrication and assembly technology development, with a focus on flip-chip bonding, contacts reliability, and manufacturability within our multi-layer chip stack.

You will define experiments and drive cross-functional collaboration to scale complex quantum systems.

Qualifications

• 4+ years in chip assembly development in deep-tech or low-volume tech, preferably flip chip in quantum computing.
• Experience with back-end process-flow development (UBM, hard-stops, bumps, detachable contacts / MEMS).
• Background in superconducting qubits is a plus; degree in physics, microwave/RF, electrical engineering or related field.

Responsibilities

• Plan and lead development of back-end fabrication and assembly technologies, focusing on flip chip bonding, contacts reliability, and manufacturability.
• Develop and coordinate integration test plans with cross-functional teams.
• Define and formalise assembly-centric fabrication and process development across the organisation.
• Establish scalable, well-documented integration procedures to support system growth.
• Investigate and resolve integration issues and technical anomalies, ensuring alignment with specifications.

Skills

Chip assembly development

Back-end process-flow development

Flip-chip technologies

UBM / contacts / MEMS

Superconducting qubits background

Physics / Microwave / RF

Education

Physics or Electrical Engineering (PhD a plus)

Bachelor's or higher in related field

Tools

UBM equipment

Flip-chip tooling

Detachable contacts / MEMS

Job description

QuantWare BV is advancing the frontiers of quantum processors using our VIO™ architecture. We are seeking an Advanced Packaging Lead to steer back-end fabrication and assembly technology development, with a focus on flip-chip bonding, contacts reliability, and manufacturability within our multi-layer chip stack.

You will define experiments and drive cross-functional collaboration to scale complex quantum systems.