Advanced Packaging Lead

QuantWare; Delft; On-site; EUR 90,000 - 140,000; Full time

Benefits offered by this job

Competitive salary

Pension plan

Hybrid work setup

Professional growth budget

Team events & offsites

Diversity & Inclusion

Job summary

QuantWare is seeking an Advanced Packaging Lead to drive back-end fabrication and assembly technologies for its quantum processors. You will lead flip‑chip bonding improvements, contacts reliability, and scalable integration within our multi-layer chip stack.

The role requires a strong background in chip assembly for deep‑tech or low‑volume environments, plus hands‑on experience with UBM, MEMS, and superconducting qubits. A related physics/engineering degree (PhD a plus) is preferred.

Qualifications

• 4+ years in chip assembly development, preferably flip chip in quantum computing.
• Hands-on back end process-flow development, including UBM, hard-stops, bumps, detachable contacts / MEMS, flip‑chip technologies.
• A background in superconducting qubits is a significant plus.
• A background in physics, microwave/RF/electrical engineering, or a related field (PhD is a plus).

Responsibilities

• Plan and lead the development of back-end fabrication and assembly technologies, with a focus on enhancing flip chip bonding techniques, contacts reliability, and manufacturability of quantum processors to our architecture chip stack.
• Develop and coordinate integration test plans in collaboration with cross-functional teams.
• Lead the definition and formalisation of assembly-centric fabrication and process development across the organisation.
• Establish scalable, well-documented integration procedures to support system growth.
• Investigate and resolve integration issues and technical anomalies, ensuring alignment with specifications and overall performance targets.

Skills

Flip chip

Back-end process flow

UBM

Detachable contacts

MEMS

Superconducting qubits

RF/microwave engineering

Physics background

Education

PhD preferred in Physics/Engineering

Bachelor's in Physics/Engineering

Tools

MEMS tooling

Job description

About Us

QuantWare is building the world’s most powerful quantum processors to solve humanity's greatest challenges. We do this with our unique VIO™ technology, the only QPU architecture that breaks the hardware barriers that have held quantum computing back, unlocking the path to MegaQubit quantum processors.

With VIO, we are paving the way for the hyper-scale quantum computers that will change the world. And delivering on that vision demands people who don’t shy away from tackling the hardest challenges of our time. That’s where you come in!

Advanced Packaging Lead, you’ll play a crucial role in developing our state of the art assembly technologies of quantum processors in our advanced multi‑layer chip stack architecture. These components development aims to achieve best in class quantum computing performance which are in turn integrated in our VIO technology. You will define fabrication and process development projects, design of experiments, and ensure seamless integration and optimisation of all technical components. Your work will be essential as we scale to increasingly complex systems and deliver on the promise of quantum computing.

What you'll be doing

• Plan and lead the development of back-end fabrication and assembly technologies, with a focus on enhancing the flip chip bonding techniques, contacts reliability, and manufacturability of quantum processors to our architecture chip stack.
• Develop and coordinate integration test plans in collaboration with cross‑functional teams.
• Lead the definition and formalisation of assembly‑centric fabrication and process development across the organisation.
• Establish scalable, well‑documented integration procedures to support system growth.
• Investigate and resolve integration issues and technical anomalies, ensuring alignment with specifications and overall performance targets.

Your Profile

• 4+ years of experience in chip assembly development of deep‑tech or low‑volume technology, preferably flip chip in quantum computing.
• Hands‑on experience with back end process‑flow development, and specifically UBM, hard‑stops, bumps, detachable contacts / MEMS, flip‑chip technologies.
• A background in superconducting qubits is a significant plus.
• A background in physics, microwave/RF/electrical engineering, or a related field (PhD is a plus)

Don't tick every box? Apply anyway. We know great candidates don't always follow a straight path, and we value diverse experience, perspectives, and ways of thinking. If this role excites you and you believe you can make an impact, we'd love to hear from you!

What We Offer:

At QuantWare, you’ll be part of a high‑performing team of world‑class experts in an ambitious, fast‑moving environment. From day one, you’ll have the trust, tools, and support to do your best work. Here’s what you can expect:

Competitive salary - A salary that reflects the impact and importance of the role (and of course 8% holiday allowance)

Pension that’s built to last - A generous and future‑proof pension plan that includes partner and dependent coverage.

Flexibility built on trust - We focus on outcomes. Work flexibly, in a hybrid setup, with an open vacation policy that lets you manage your time

Personal growth - We invest in your L&D, with a budget available to each team member, dependent on their individual ambitions, development needs, and performance

A connected team - We make space to celebrate wins together, with team events, offsites, and spontaneous moments that bring us closer

Diversity & Inclusion at QuantWare

We’re an ambitious company, not only for our goals but also to become an even more diverse and inclusive team. We know this helps us with better decisions, more innovation, and strengthens our culture. In particular, we’d love to see more women in the quantum industry! So if you’re a female talent, excited about this opportunity but don’t meet every single requirement, we still encourage you to apply.

As part of our recruitment process, candidates may be required to undergo pre‑employment screening.