Senior Quantum Packaging & Integration Lead

QuantWare; Delft; Hybrid; EUR 90,000 - 140,000; Full time

Benefits offered by this job

Competitive salary

Pension plan

Hybrid work setup

Professional growth budget

Team events & offsites

Diversity & Inclusion

Job summary

QuantWare is seeking an Advanced Packaging Lead to drive back-end fabrication and assembly technologies for its quantum processors. You will lead flip‑chip bonding improvements, contacts reliability, and scalable integration within our multi-layer chip stack.

The role requires a strong background in chip assembly for deep‑tech or low‑volume environments, plus hands‑on experience with UBM, MEMS, and superconducting qubits. A related physics/engineering degree (PhD a plus) is preferred.

Qualifications

• 4+ years in chip assembly development, preferably flip chip in quantum computing.
• Hands-on back end process-flow development, including UBM, hard-stops, bumps, detachable contacts / MEMS, flip‑chip technologies.
• A background in superconducting qubits is a significant plus.
• A background in physics, microwave/RF/electrical engineering, or a related field (PhD is a plus).

Responsibilities

• Plan and lead the development of back-end fabrication and assembly technologies, with a focus on enhancing flip chip bonding techniques, contacts reliability, and manufacturability of quantum processors to our architecture chip stack.
• Develop and coordinate integration test plans in collaboration with cross-functional teams.
• Lead the definition and formalisation of assembly-centric fabrication and process development across the organisation.
• Establish scalable, well-documented integration procedures to support system growth.
• Investigate and resolve integration issues and technical anomalies, ensuring alignment with specifications and overall performance targets.

Skills

Flip chip

Back-end process flow

UBM

Detachable contacts

MEMS

Superconducting qubits

RF/microwave engineering

Physics background

Education

PhD preferred in Physics/Engineering

Bachelor's in Physics/Engineering

Tools

MEMS tooling

Job description

QuantWare is seeking an Advanced Packaging Lead to drive back-end fabrication and assembly technologies for its quantum processors. You will lead flip‑chip bonding improvements, contacts reliability, and scalable integration within our multi-layer chip stack.

The role requires a strong background in chip assembly for deep‑tech or low‑volume environments, plus hands‑on experience with UBM, MEMS, and superconducting qubits. A related physics/engineering degree (PhD a plus) is preferred.