3D Packaging Engineer for Quantum Tech — Hybrid Role

QuantWare BV; Delft; Hybrid; EUR 60,000 - 90,000; Full time

Benefits offered by this job

Competitive salary

Pension that’s built to last

Flexibility built on trust

Personal growth

A connected team

Job summary

QuantWare, Delft, Netherlands, is seeking a 3D Packaging Engineer to collaborate with the engineering team on physically realizing VIO products. You will operate and fine-tune high-precision assembly equipment to meet stringent tolerances for quantum devices.

The role requires hands-on experience with semiconductor assembly platforms and a strong foundation in 3D integration concepts, including TSVs and interposers, under thermal and cryogenic conditions. A hybrid setup is offered.

Qualifications

• Education required: BS, MS, or PhD in Mechanical Engineering, Mechatronics, Physics, Materials Science, or related field.
• Experience: 3–5 years operating and adjusting high-accuracy semiconductor assembly platforms.
• Proven ability to achieve tight placement tolerances (~1 µm) in R&D or pilot production.

Responsibilities

• Tooling Adaptation: modify and calibrate high-precision assembly equipment to meet unique 3D integration specs.
• Process Optimization: develop/refine placement and bonding processes for non-standard substrates; test adhesives, glues, and solders for extreme conditions.
• 3D Assembly Execution: execute complex integration strategies including multi-die stacking and interposer-based 3D architectures.

Skills

High-precision assembly experience

3D integration knowledge

Thermal/vacuum/cryogenic awareness

Education

BS/MS/PhD in Mechanical Eng

Tools

High-precision assembly platforms

Job description

QuantWare, Delft, Netherlands, is seeking a 3D Packaging Engineer to collaborate with the engineering team on physically realizing VIO products. You will operate and fine-tune high-precision assembly equipment to meet stringent tolerances for quantum devices.

The role requires hands-on experience with semiconductor assembly platforms and a strong foundation in 3D integration concepts, including TSVs and interposers, under thermal and cryogenic conditions. A hybrid setup is offered.