Advanced Packaging Lead

Entangled Future; Delft; Hybrid; EUR 110,000 - 140,000; Full time

Benefits offered by this job

Holiday allowance 8%

Pension plan

Hybrid work

Job summary

QuantWare in Delft is seeking an Advanced Packaging Lead to steer the development of back-end fabrication and assembly technologies for quantum processors, focusing on flip chip bonding, contact reliability, and manufacturability within our architecture chip stack.

You will coordinate integration plans with cross-functional teams, establish scalable procedures, and drive issues resolution to meet performance targets in a high-speed, high-trust environment.

Qualifications

• Minimum 4+ years in chip assembly development in deep-tech or low-volume tech.
• Hands-on back-end process-flow development with UBM, hard-stops, bumps and detachable contacts/MEMS.
• Background in superconducting qubits is a significant plus.
• Physics or related field; PhD is a plus.

Responsibilities

• Plan and lead development of back-end fabrication and assembly technologies for quantum processors.
• Develop and coordinate integration test plans with cross-functional teams.
• Lead the definition and formalisation of assembly-centric fabrication and process development.
• Establish scalable, well-documented integration procedures to support system growth.
• Investigate and resolve integration issues ensuring alignment with specs and targets.

Skills

Flip chip

Back-end process-flow

Contacts reliability

Quantum hardware

Education

Physics or related field (PhD preferred)

Tools

UBM

Hard-stops

Bumps

MEMS / detachable contacts

Job description

Advanced Packaging Lead at QuantWare, Delft. A lead-level full time position in the Research & Development team, listed under hardware engineering.

At QuantWare, you’ll be part of a high-performing team of world-class experts in an ambitious, fast-moving environment. From day one, you’ll have the trust, tools, and support to do your best work. Here’s what you can expect: Competitive salary - A salary that reflects the impact and importance of the role (and of course 8% holiday allowance) Pension that’s built to last - A generous and future-proof pension plan that includes partner and dependent coverage.

Flexibility built on trust - We focus on outcomes. Work flexibly, in a hybrid setup, with an open vacation policy that lets you manage your time Personal growth - We invest in your L&D, with a budget available to each team member, dependent on their individual ambitions, development needs, and performance A connected team - We make space to celebrate wins together, with team events, offsites, and spontaneous moments that bring us closer

Responsibilities

• Plan and lead the development of back-end fabrication and assembly technologies, with a focus on enhancing the flip chip bonding techniques, contacts reliability, and manufacturability of quantum processors to our architecture chip stack.
• Develop and coordinate integration test plans in collaboration with cross-functional teams.
• Lead the definition and formalisation of assembly-centric fabrication and process development across the organisation.
• Establish scalable, well-documented integration procedures to support system growth.
• Investigate and resolve integration issues and technical anomalies, ensuring alignment with specifications and overall performance targets.

Requirements

• 4+ years of experience in chip assembly development of deep-tech or low-volume technology, preferably flip chip in quantum computing.
• Hands-on experience with back end process-flow development, and specifically UBM, hard-stops, bumps, detachable contacts / MEMS, flip-chip technologies.
• A background in superconducting qubits is a significant plus.
• A background in physics, microwave/RF/electrical engineering, or a related field (PhD is a plus)