Quantum Packaging Lead: Flip-Chip & Chip-Stack Integration

QuantWare BV; Delft; Hybrid; EUR 90,000 - 120,000; Full time

Benefits offered by this job

Competitive salary

Pension plan with partner/dependent

Hybrid work setup

L&D budget

Team events and offsites

Job summary

QuantWare BV in Delft seeks an Advanced Packaging Lead to drive back-end fabrication and assembly for our quantum processor stack. You will define experiments, coordinate cross-functional teams and ensure scalable integration aligned with our VIO architecture.

The role requires 4+ years in chip assembly development (preferably flip-chip in quantum computing), hands-on experience with UBM, MEMS and detachable contacts, and a background in superconducting qubits or RF/electrical engineering.

Qualifications

• 4+ years in chip assembly development, preferably flip chip in quantum computing.
• Experience with back-end process-flow development, UBM, hard-stops, bumps, detachable contacts / MEMS.
• Background in superconducting qubits is a significant plus.
• Degree background in physics, microwave/RF/electrical engineering (PhD a plus).

Responsibilities

• Plan and lead development of back-end fabrication and assembly technologies for quantum processors.
• Develop and coordinate integration test plans with cross-functional teams.
• Lead the definition and formalisation of assembly-centric fabrication and process development.
• Establish scalable, well-documented integration procedures for system growth.
• Investigate and resolve integration issues ensuring alignment with specs.

Skills

Back-end fabrication

Flip-chip tech

UBM

MEMS contacts

Superconducting qubits

RF / Microwave physics

Education

PhD in physics/engineering

Tools

Flip-chip process tooling

Process-flow development

Job description

QuantWare BV in Delft seeks an Advanced Packaging Lead to drive back-end fabrication and assembly for our quantum processor stack. You will define experiments, coordinate cross-functional teams and ensure scalable integration aligned with our VIO architecture.

The role requires 4+ years in chip assembly development (preferably flip-chip in quantum computing), hands-on experience with UBM, MEMS and detachable contacts, and a background in superconducting qubits or RF/electrical engineering.