Wire Bond Process Specialist

NXP Semiconductors; Kuala Lumpur; On-site; MYR 47,000 - 69,000; Full time

Job summary

NXP Semiconductors in Malaysia is seeking a Wire Bond Process Technician with a Diploma or higher in Engineering. You will perform wire bond tasks on quality hold material and collaborate with engineering to improve WB processes and techniques.

You will assist in resolving WB-related issues to minimize production downtime, requiring strong attention to detail and troubleshooting skills. NXP Semiconductors is a world leader in secure connectivity solutions for embedded applications, delivering

Qualifications

• Diploma or higher in Engineering or a related field.
• Working experience with WB process is preferable.
• Strong attention to detail and analytical troubleshooting skills.

Responsibilities

• Perform wire bond process task on quality hold material.
• Collaborate with engineering to improve WB processes and techniques.
• Assist in resolving WB-related issues to minimize production downtime.

Skills

Attention to detail

Troubleshooting

Collaborative/Teamwork

Education

Diploma or above in Engineering

Tools

Wire Bond Process

Job description

NXP Semiconductors in Malaysia is seeking a Wire Bond Process Technician with a Diploma or higher in Engineering. You will perform wire bond tasks on quality hold material and collaborate with engineering to improve WB processes and techniques.

You will assist in resolving WB-related issues to minimize production downtime, requiring strong attention to detail and troubleshooting skills. NXP Semiconductors is a world leader in secure connectivity solutions for embedded applications, delivering