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NXP Semiconductors in Malaysia is seeking a Wire Bond Process Technician with a Diploma or higher in Engineering. You will perform wire bond tasks on quality hold material and collaborate with engineering to improve WB processes and techniques.
You will assist in resolving WB-related issues to minimize production downtime, requiring strong attention to detail and troubleshooting skills. NXP Semiconductors is a world leader in secure connectivity solutions for embedded applications, delivering
NXP Semiconductors N.V. (NASDAQ: NXPI) enables a smarter, safer, and more sustainable world through innovation. As the world leader in secure connectivity solutions for embedded applications, NXP is pushing boundaries in the automotive, industrial & IoT, mobile, and communication infrastructure markets. For more information, visit www.nxp.com
Bright Minds. Bright Futures.
Commitment At NXP.
We recognize NXP is a powerful change agent as we continue to deliver innovative solutions that advance a more sustainable future. We remain steadfast in our commitment to sustainability and making measurable year-on-year progress.
Also, we aim to create an inclusive work environment and we will not tolerate racism, discrimination or harassment of any kind. We have programs in place focused on diversity, inclusion and equality.
Please note that NXP operates under a strict Preferred Supplier List (PSL) for all recruitment activities. Any candidate profiles or resume submitted without a prior written agreement or explicit request from our Talent Acquisition team will be considered unsolicited. Such submissions will be deemed free of any obligations, and no fees will be paid by NXP or any of its affiliates, subsidiaries, or divisions - regardless of whether the candidate is hired, either coincidentally or otherwise.
Thank you for considering a career at NXP.