Die Prep Equipment Engineer (MES Project)

118-WW TMG MFG OPS; Kuala Lumpur; On-site; MYR 60,000 - 90,000; Full time

Job summary

TI is recruiting an Equipment Engineer to lead the MES rollout for Die Prep equipment, driving the digital transformation and then transitioning to production to optimize uptime and automation in a high-volume setting.

The role requires hands-on Die Prep/Dicing equipment experience, strong data analysis and collaboration across functions, with a focus on reliability and MES-driven improvements.

Qualifications

• Bachelor's degree in an engineering field (Electrical, Electrical/Computer, Chemical, Mechanical, Materials Science, Physics) or related discipline.
• 2+ years hands-on semiconductor Die Prep/Dicing equipment experience.

Responsibilities

• MES Implementation (Project Phase): Represent Die Prep equipment engineering in the MES rollout. Define workflows, setup/recipe controls, and equipment states.
• Integration & Data: Translate Die Prep hardware requirements into digital designs. Define data collection points for equipment health and interlock logic.
• Validation: Validate integration scenarios and support UAT and deployment.
• Sustaining (Post-Project Phase): Transition to production to maintain Die Prep equipment reliability and leverage MES data for predictive maintenance and automation.

Skills

Die Prep equipment

MES knowledge

Data analysis

Project coordination

Communication skills

Education

Bachelor's degree

Job description

Change the world. Love your job.

Join TI as a specialized Equipment Engineer to drive the digital transformation of our Die Prep lines. This is a unique, multi-phase role: following a 1 month TI orientation familiarizing with TI systems while being deployed into a critical MES implementation project team for 1-2 years. Upon successful project completion, you will transition into a production role, utilizing your deep MES expertise to optimize equipment uptime and automation in a high-volume manufacturing environment.

Key Responsibilities:

• MES Implementation (Project Phase): Represent Die Prep equipment engineering in the MES rollout. Define workflows, setup/recipe controls, and equipment states.
• Integration & Data: Translate Die Prep hardware requirements (e.g., dicing/sawing mechanics) into digital designs. Define data collection points for equipment health and interlock logic.
• Validation: Validate integration scenarios and support UAT and deployment.
• Sustaining (Post-Project Phase): Transition to production to maintain Die Prep equipment reliability and leverage MES data for predictive maintenance and automation.

Minimum Requirements:

• Minimum Education (Bachelor's degree Electrical Engineering, Electrical Computer Engineering, Chemical Engineering, Mechanical Engineering, Materials Science Engineering,) Physics or related engineering degree
• Strong hands-on semiconductor equipment experience in Die Prep/Dicing equipment, with minimum 2 years of relevant experience

Preferred Qualifications:

• Equipment experience with Backgrind, Mechanical Saw, Laser Saw are welcome
• Candidate with MES experiences
• Experience on tool monitoring and interdiction software, and equipment maintenance and documentation
• Working knowledge of semiconductor manufacturing, and SPC techniques. Experienced with semiconductor cleanroom protocol and behaviors.
• Strong verbal and written communication skills
• Demonstrated strong analytical, critical thinking and problem solving skills
• Ability to work in teams and collaborate effectively with people in different functions
• Ability to take the initiative and drive for results
• Strong time management skills that enable on-time project delivery
• Ability to work effectively in an interrupt-driven, fast-paced and rapidly changing environment
• Demonstrated ability to build strong, influential relationship