Wafer Sawing Engineer: Process & Quality Improvement

Carsem (M) Sdn. Bhd; Ipoh; On-site; MYR 67,000 - 134,000; Full time

Benefits offered by this job

Medical

Education support

Dental

Parking

Medical for immediate family members

Car subsidy

Job summary

Carsem (M) Sdn. Bhd, a leading semiconductor packaging and test services provider in Ipoh, seeks an experienced engineer to lead equipment operations and process support in wafer sawing/dicing.

The role emphasizes hands-on troubleshooting, root-cause analysis, and continuous improvements across 4M, DOE, and automation, with strong collaboration to meet quality and customer requirements. You will supervise a team of Technicians, ensure cleanroom discipline, participate in audits, and align with

Qualifications

• Degree in Mechanical, Electrical, Electronic, Mechatronics, or related Engineering.
• 3–5 years' experience in semiconductor manufacturing, wafer sawing/dicing.
• Hands-on experience with DISCO wafer saw machines.
• Familiar with DOE methodologies and automation/equipment troubleshooting.
• Exposure to IoT-based monitoring and predictive maintenance solutions is a plus.
• Strong understanding of cleanroom protocols and wafer contamination control.
• Proven ability in failure analysis and root cause investigation.
• Good understanding of quality compliance, 4M analysis, and customer audit requirements (VOC/VOP).
• Strong problem-solving, communication, and time management skills.
• Hands-on, proactive, and able to work independently and in a team.

Responsibilities

• Equipment Operations & Troubleshooting: Supervise and guide a team of Technicians on engineering activities.
• Oversee CSMO wafer saw quality and issues; troubleshoot through 4M analysis.
• Conduct root cause analysis and implement corrective actions to resolve recurring equipment failures.
• Process & Technical Support: Establish critical process parameters for new devices or customers.
• Drive continuous improvements, e.g. through Automation and SOP enhancement.
• Attend customer meetings and audits; minimize customer complaints (VOC/VOP) and manage MRB.
• Compliance & Continuous Improvement: Ensure quality accountability and compliance to spec with continuous enhancement.
• Involvement in 5S initiatives; perform any other duties as assigned by immediate superior.

Education

Bachelor's degree in Mechanical, Electrical, Electronic, Mechatronics, or related Engineering

Tools

DISCO wafer saw

Job description

Carsem (M) Sdn. Bhd, a leading semiconductor packaging and test services provider in Ipoh, seeks an experienced engineer to lead equipment operations and process support in wafer sawing/dicing.

The role emphasizes hands-on troubleshooting, root-cause analysis, and continuous improvements across 4M, DOE, and automation, with strong collaboration to meet quality and customer requirements. You will supervise a team of Technicians, ensure cleanroom discipline, participate in audits, and align with