Senior Process Engineer (NPI & Wafer Dicing)

Carsem (M) Sdn. Bhd; Ipoh; On-site; MYR 120,000 - 180,000; Full time

Benefits offered by this job

Medical education support

Dental

Parking

Car subsidy

Job summary

Carsem (M) Sdn. Bhd is seeking a Senior Process Engineer to lead wafer sawing/dicing for NPI projects in Ipoh, Malaysia. You will optimize process parameters, conduct DOE and CAPA, and collaborate with multiple teams to ensure successful production transfer.

The role requires 5–8 years in semiconductor manufacturing, with 3+ years in NPI and wafer dicing, plus familiarity with DISCO/ADT/Synova equipment and DOE/SPC/FMEA methods.

Qualifications

• Minimum 5–8 years of experience in semiconductor manufacturing.
• At least 3 years in NPI, wafer sawing/dicing process engineering, or a similar technical role.
• Experience with wafer dicing equipment (e.g., DISCO, ADT, Synova) is highly preferred.
• Familiarity with DOE, SPC, FMEA, 8D, Six Sigma, and statistical process analysis.
• Strong knowledge of wafer sawing/dicing processes within semiconductor assembly and test.

Responsibilities

• Lead the wafer sawing process for NPI projects from evaluation through production release.
• Develop, optimize, and validate process parameters to achieve yield, quality, and productivity.
• Conduct CAPA to resolve issues such as wafer chipping, edge cracking, die shift, and yield loss.
• Plan DOE and process characterization for new materials and dicing technologies.
• Collaborate with cross-functional teams to ensure timely project execution and risk mitigation.

Skills

Wafer sawing/dicing

NPI experience

CAPA

Process optimization

DOE

SPC

FMEA

8D

Root cause analysis

Tools

DISCO

ADT

Synova

Job description

Senior Process Engineer (NPI & Wafer Dicing)

Lead the wafer sawing process for New Product Introduction (NPI) projects from initial product evaluation through process qualification and production release.

Develop, optimize, and validate wafer sawing process parameters, including blade selection, spindle speed, feed rate, and cutting depth, to achieve targeted yield, quality, and productivity.

Conduct root cause analysis and implement corrective and preventive actions (CAPA) to resolve process issues such as wafer chipping, edge cracking, die shift, and yield loss.

Plan and execute Design of Experiments (DOE) and process characterization activities to evaluate new materials, wafer thicknesses, and advanced dicing technologies, including laser grooving, stealth dicing, and hybrid dicing methods.

Support equipment installation, setup, qualification, and buy-off activities to ensure readiness for new product introduction and compliance with customer specifications.

Collaborate closely with cross-functional teams, including Process Engineering, Equipment Engineering, Quality Assurance, Production Planning, Manufacturing, and NPI Program Management, to ensure timely project execution and risk mitigation.

Prepare, review, and approve process documentation, including Standard Operating Procedures (SOPs), work instructions, process flow documents, FMEA, and Control Plans.

Monitor and analyze key manufacturing performance indicators such as yield, Overall Equipment Effectiveness (OEE), Units Per Hour (UPH), cycle time, and equipment downtime, and drive continuous improvement initiatives.

Ensure compliance with customer requirements, quality standards, and internal manufacturing procedures throughout the NPI lifecycle.

Provide technical guidance and mentoring to junior engineers and technicians while supporting knowledge sharing and capability development within the team.

Strong knowledge of wafer sawing/dicing processes within the semiconductor assembly and test environment.

Experience in New Product Introduction (NPI), process qualification, and production transfer.

Proficient in Design of Experiments (DOE), Statistical Process Control (SPC), Failure Mode and Effects Analysis (FMEA), and root cause analysis methodologies (8D, Fishbone, 5 Why).

Knowledge of semiconductor packaging, SMT processes, and manufacturing process control is an advantage.

Familiarity with wafer dicing equipment, tooling, and process optimization techniques.

Strong analytical, problem-solving, and troubleshooting skills.

Excellent cross-functional collaboration and stakeholder management abilities.

Good project management, communication, and presentation skills.

Ability to work independently in a fast-paced manufacturing environment while managing multiple NPI projects simultaneously.

Experience Requirement

Minimum 5–8 years of experience in semiconductor manufacturing.

At least 3 years in NPI, wafer sawing/dicing process engineering, or a similar technical role.

Experience with wafer dicing equipment (e.g., DISCO, ADT, Synova) is highly preferred.

Familiarity with DOE, SPC, FMEA, 8D, Six Sigma, and statistical process analysis.

Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest range package & test portfolios in the world.

Founded in 1972, Carsem is among the most experienced companies in our industry and is recognized as one of the largest in unit volume production. We have over 6,000 employees and ship in excess of 100 million units each week and more than 65% of this volume is shipped as fully tested product. Carsem is a member of one of South East Asia's most successful corporations, the Hong Leong Group, who views semiconductors as a core business.

We have three high technology factories. Two are located in Ipoh, Malaysia, and a new third factory is located in Suzhou, China. The two factories in Malaysia, Carsem - M Site and Carsem - S Site, are 10 miles (16Km) apart. Ipoh is a 90 minute drive from Penang and 2.5 hours from Kuala Lumpur.

The factories are supported by extensive R&D and failure analysis staff and incorporate highly sophisticated, "state of the art" automated equipment, ensuring quality products which meet the exacting standards of all the automotive, telecom, computer and consumer goods industries. Both factories maintain world-class quality standards having achieved ISO/TS 16949, ISO-9001, ISO-14001 certifications and comply to the Sony Green Partner Program. They are supported with a global network of sales and technical support offices. The China factory, Carsem-Suzhou Ltd., is located in the province of Jiangsu, 50 miles (80Km) west of Shanghai. The new factory is 172K sq. ft. (16K sq. m.) and is on 645K sq. ft. (60K sq. m.) of land in the Suzhou Industrial Park. The construction was completed in January 2004, the staff has been through extensive training in Carsem's existing Malaysian factories and the assembly and test equipment to support the manufacture of the MLP (Micro Leadframe Package) Quad and Dual was installed during the second quarter of 2004. Customer qualifications were completed during the second quarter and the factory started shipping production volumes during the third quarter of 2004.

Product & Services

Product Groups Assembled at M Site: MLP MICRO I.C. PDIP (300/600 Mil), PLCC, SOIC (150Mil), MSOP (3.0mm), QSOP (150Mil) MICRO SOT 23, SOT66x, TSOT, SOT, TO92; SC 70 POWER TO220, DDPAK, SOT223 S Site

S Site commenced operations in April,1992. The factory has a total floor space of 384,000 sq. ft. (35,700 M2), a work force of 4,300 employees and the ability to expand by 270,000 sq. ft. (25,000 M2) in the future. Product Groups Assembled at S Site: MLP QUAD, DUAL ARRAY SSBGA, SSLGA, FTBGA, CBGA I.C. PDIP (300 Mil), PLCC, SOIC (150/300 Mil), QSOP (300 Mil), SSOP (5.3mm), TSSOP (4.4/ 6.1mm) QFP MQFP, LQFP, TQFP SiP System in Package

Other Information

VISION

"To be a World Class Company Offering Assembly, Test/Finishing Solutions to Semiconductor Companies Throughout the World"

MISSION

"Carsem will Continue to show Profitable Growth with Emphasis on Employee Development and Operational and Service Indices to Ensure that we are the Employer Of Choice and Supplier Of Choice"

QUALITY

Carsem's policy is to provide products and services of the highest quality through "ZERO DEFECTS TODAY!", preventive Quality culture. Employees will act with honesty, sincerity and operate as a team to continuously strive for improvements in quality, productivity, delivery, services and cost in order to be competitive and profitable. ZERO DEFECTS QUALITY is the responsibility of every employee.

PERSONAL DATA PROTECTION

The Hong Leong Group use personal data in accordance with the Hong Leong Group Privacy Notice for new applicants which can be found (http://www.hongleong.com.my).

Perks and benefits

• Medical Education support
• Dental Parking
• Medical for immediate family members
• car subsidy