Lead NPI Wafer Dicing Process Engineer
Carsem (M) Sdn. Bhd
Don’t send a generic resume — generate a resume and cover letter tailored to this exact role.
Benefits offered by this job
Job summary
Carsem (M) Sdn. Bhd is seeking a Senior Process Engineer to lead wafer sawing/dicing for NPI projects in Ipoh, Malaysia. You will optimize process parameters, conduct DOE and CAPA, and collaborate with multiple teams to ensure successful production transfer.
The role requires 5–8 years in semiconductor manufacturing, with 3+ years in NPI and wafer dicing, plus familiarity with DISCO/ADT/Synova equipment and DOE/SPC/FMEA methods.
Qualifications
- Minimum 5–8 years of experience in semiconductor manufacturing.
- At least 3 years in NPI, wafer sawing/dicing process engineering, or a similar technical role.
- Experience with wafer dicing equipment (e.g., DISCO, ADT, Synova) is highly preferred.
- Familiarity with DOE, SPC, FMEA, 8D, Six Sigma, and statistical process analysis.
- Strong knowledge of wafer sawing/dicing processes within semiconductor assembly and test.
Responsibilities
- Lead the wafer sawing process for NPI projects from evaluation through production release.
- Develop, optimize, and validate process parameters to achieve yield, quality, and productivity.
- Conduct CAPA to resolve issues such as wafer chipping, edge cracking, die shift, and yield loss.
- Plan DOE and process characterization for new materials and dicing technologies.
- Collaborate with cross-functional teams to ensure timely project execution and risk mitigation.
Skills
Tools
Job description
Carsem (M) Sdn. Bhd is seeking a Senior Process Engineer to lead wafer sawing/dicing for NPI projects in Ipoh, Malaysia. You will optimize process parameters, conduct DOE and CAPA, and collaborate with multiple teams to ensure successful production transfer.
The role requires 5–8 years in semiconductor manufacturing, with 3+ years in NPI and wafer dicing, plus familiarity with DISCO/ADT/Synova equipment and DOE/SPC/FMEA methods.
'/%3e%3cpath%20d='M101.744%2012.4726L102.894%2016.1947L99.0021%2013.2201L101.744%2012.4726ZM105.3%208.40937H100.488L99.0026%203.59473L97.5116%208.41047L92.7%208.40385L96.5965%2011.3834L95.1055%2016.1942L99.0021%2013.2196L101.408%2011.3834L105.3%208.40992V8.40937Z'%20fill='white'/%3e%3cdefs%3e%3clinearGradient%20id='paint0_linear_5593_1381'%20x1='90'%20y1='9.44471'%20x2='99'%20y2='9.44471'%20gradientUnits='userSpaceOnUse'%3e%3cstop%20stop-color='%2300AD70'/%3e%3cstop%20offset='0.998594'%20stop-color='%2300B67A'/%3e%3cstop%20offset='1'%20stop-color='%23DCDCE6'/%3e%3c/linearGradient%3e%3c/defs%3e%3c/svg%3e){kind=small}
