Senior Equipment Engineer (Backgrind & FOL)

Carsem (M) Sdn. Bhd; Ipoh; On-site; MYR 70,000 - 110,000; Full time

Benefits offered by this job

Medical

Education support

Dental

Parking

Medical for immediate family

Car subsidy

Job summary

Carsem (M) Sdn. Bhd in Ipoh, Malaysia, is seeking an Equipment Engineer to plan and execute preventive and corrective maintenance on semiconductor equipment.

You will supervise technicians, troubleshoot issues, and support machine upgrades while coordinating with production and engineering teams for proper setup and qualification. The role requires a Bachelor's degree in engineering and 3–5 years in equipment maintenance within semiconductor manufacturing, with hands-on experience on Backgrind

Qualifications

• Bachelor's degree in engineering or equivalent required.
• 3–5 years of equipment maintenance experience in semiconductor manufacturing.
• Hands-on with Backgrind and FOL equipment listed, plus calibration and PM knowledge.
• Experience leading or supervising maintenance technicians is an added advantage.
• Good analytical and problem-solving skills under pressure.

Responsibilities

• Plan, coordinate, and execute preventive and corrective maintenance to optimize equipment performance and minimize downtime.
• Supervise, guide, and train maintenance technicians to meet maintenance and production targets.
• Troubleshoot equipment issues and support machine upgrades and continuous improvement initiatives.
• Coordinate with production and engineering to ensure proper setup, qualification, and release for production.
• Monitor spare parts inventory to ensure adequate stock for maintenance activities.
• Ensure calibration and maintenance of manufacturing equipment and measuring instruments per standards.
• Drive SOP, safety, and quality compliance within maintenance.
• Investigate abnormalities, implement corrective actions, and monitor effectiveness.
• Support quality improvement activities and communicate equipment-related issues across shifts and departments.

Skills

Maintenance planning

Supervising technicians

Troubleshooting

Calibration

Teamwork

Education

Bachelor's Degree in Mechatronics, Electrical, Electronic, Mechanical Engineering

Tools

Backgrind machinery

Grinder

Polisher

Detaper

Inline Machines

Auto Mounter (Dicing Tape/DAF Tape)

Taiko Wafer Ring Removal

Wafer Sawing

AOI equipment

Job description

Plan, coordinate, and execute preventive and corrective maintenance activities to ensure optimum equipment performance and minimize downtime.

Supervise, guide, and train maintenance technicians to achieve maintenance and production targets.

Troubleshoot equipment issues and support machine upgrading, modification, and continuous improvement initiatives.

Coordinate with production and engineering teams to ensure equipment is properly set up, qualified, and released for production.

Monitor spare parts inventory and ensure sufficient stock availability to support maintenance activities.

Ensure all manufacturing equipment and measuring instruments are calibrated and maintained according to established standards.

Drive compliance with SOPs, safety requirements, and quality standards within the maintenance function.

Investigate equipment-related abnormalities, implement corrective actions, and monitor effectiveness.

Support quality improvement activities and communicate equipment or quality-related issues across shifts and departments.

Requirements

Bachelor's Degree in Mechatronics, Electrical, Electronic, Mechanical Engineering, or equivalent.

Minimum 3-5 years of experience in equipment maintenance within a semiconductor manufacturing environment.

Hands‑on experience with Backgrind and FOL equipment such as Grinder, Polisher, Detaper, Inline Machines, Auto Mounter (Dicing Tape/DAF Tape), Taiko Wafer Ring Removal, Wafer Sawing, and AOI equipment.

Strong knowledge of preventive maintenance, troubleshooting, machine setup, and equipment qualification processes.

Experience leading or supervising maintenance technicians is an added advantage.

Good analytical and problem‑solving skills with the ability to work under pressure in a fast‑paced manufacturing environment.

Familiar with quality systems, calibration requirements, and continuous improvement methodologies.

Good communication and teamwork skills.

Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest range package & test portfolios in the world.

Founded in 1972, Carsem is among the most experienced companies in our industry and is recognized as one of the largest in unit volume production. We have over 6,000 employees and ship in excess of 100 million units each week and more than 65% of this volume is shipped as fully tested product. Carsem is a member of one of South East Asia's most successful corporations, the Hong Leong Group, who views semiconductors as a core business.

We have three high technology factories. Two are located in Ipoh, Malaysia, and a new third factory is located in Suzhou, China. The two factories in Malaysia, Carsem - M Site and Carsem - S Site, are 10 miles (16Km) apart. Ipoh is a 90 minute drive from Penang and 2.5 hours from Kuala Lumpur.

The factories are supported by extensive R&D and failure analysis staff and incorporate highly sophisticated, "state of the art" automated equipment, ensuring quality products which meet the exacting standards of all the automotive, telecom, computer and consumer goods industries. Both factories maintain world-class quality standards having achieved ISO/TS 16949, ISO-9001, ISO-14001 certifications and comply to the Sony Green Partner Program. They are supported with a global network of sales and technical support offices. The China factory, Carsem‑Suzhou Ltd., is located in the province of Jiangsu, 50 miles (80Km) west of Shanghai. The new factory is 172K sq. ft. (16K sq. m.) and is on 645K sq. ft. (60K sq. m.) of land in the Suzhou Industrial Park. The construction was completed in January 2004, the staff has been through extensive training in Carsem's existing Malaysian factories and the assembly and test equipment to support the manufacture of the MLP (Micro Leadframe Package) Quad and Dual was installed during the second quarter of 2004. Customer qualifications were completed during the second quarter and the factory started shipping production volumes during the third quarter of 2004.

Product & Services

Product Groups Assembled at M Site: MLP MICRO I.C. PDIP (300/600 Mil), PLCC, SOIC (150Mil), MSOP (3.0mm), QSOP (150Mil) MICRO SOT 23, SOT66x, TSOT, SOT, TO92; SC 70 POWER TO220, DDPAK, SOT223 S Site

S Site commenced operations in April,1992. The factory has a total floor space of 384,000 sq. ft. (35,700 M2), a work force of 4,300 employees and the ability to expand by 270,000 sq. ft. (25,000 M2) in the future. Product Groups Assembled at S Site: MLP QUAD, DUAL ARRAY SSBGA, SSLGA, FTBGA, CBGA I.C. PDIP (300 Mil), PLCC, SOIC (150/300 Mil), QSOP (300 Mil), SSOP (5.3mm), TSSOP (4.4/ 6.1mm) QFP MQFP, LQFP, TQFP SiP System in Package

Other Information

VISION

"To be a World Class Company Offering Assembly, Test/Finishing Solutions to Semiconductor Companies Throughout the World"

MISSION

"Carsem will Continue to show Profitable Growth with Emphasis on Employee Development and Operational and Service Indices to Ensure that we are the Employer Of Choice and Supplier Of Choice"

QUALITY

Carsem's policy is to provide products and services of the highest quality through "ZERO DEFECTS TODAY!", preventive Quality culture. Employees will act with honesty, sincerity and operate as a team to continuously strive for improvements in quality, productivity, delivery, services and cost in order to be competitive and profitable. ZERO DEFECTS QUALITY is the responsibility of every employee.

PERSONAL DATA PROTECTION

The Hong Leong Group use personal data in accordance with the Hong Leong Group Privacy Notice for new applicants which can be found (http://www.hongleong.com.my).

Perks and benefits Medical Education support Dental Parking Medical for immediate family members, car subsidy

What can I earn as an Equipment Engineer