Technical Services Engineer - Wire Bonding & Customer Solutions

Tanaka Electronics (M) Sdn Bhd

Bayan Lepas

On-site

MYR 90,000 - 150,000

Full time

8 days ago

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Benefits offered by this job

Medical

Miscellaneous allowance

Insurance

Dental & Optical

Parking

Annual Dinner

Family Day

Company Trip

Birthday JLPT Language Allowance

Job summary

Tanaka Electronics (Malaysia) Sdn. Bhd. is seeking an experienced Technical Service Sr.

Engineer (Wire Bonding) to support customers, troubleshoot wire bonding issues, and drive product improvements in semiconductor packaging. The role requires strong problem-solving skills, Mandarin and English proficiency, and willingness to travel. The ideal candidate holds a Bachelor’s degree in Materials, Electronics, or Mechanical Engineering with at least 5 years of relevant experience; junior engineers

Qualifications

Bachelor's degree in Materials, Electronics, Mechanical Engineering, or a related field.
Experience or knowledge in wire bonding and semiconductor packaging.
Proficiency in Mandarin and English for customer communication.
Strong analytical, troubleshooting, and communication skills.

Responsibilities

Provide technical support and troubleshoot wire bonding issues at customer sites.
Understand customer needs and recommend effective technical solutions.
Conduct technical evaluations and projects to improve product performance.
Collaborate with internal teams on product development and customer satisfaction.
Guide and support engineers and technicians.
Prepare technical reports and evaluation results.