Staff Process Engineer - PQFN & Thin Die Assembly

Renesaselectronics; Hang Tuah Jaya; On-site; MYR 85,000 - 140,000; Full time

Job summary

Renesas Electronics in Malaysia seeks a manufacturing/packaging engineer to qualify PQFN packages for SPS products, scale up production, and improve assembly yield, cost and capacity. You will collaborate with Test, Product, Quality and Operations to address feedback and drive continuous improvements.

You will manage lifecycle documents, coordinate supplier changes, and support NPI-to-production transfers while ensuring adherence to quality and reliability standards in a fast-paced manufacturing

Qualifications

• Degree in Mechanical, Materials, Physics, Chemistry or Applied Sciences.
• Experience in process engineering or package development for thin wafer handling and SPS solder attach processes.
• Knowledge of PQFNs/QFNs/WLCSP and leaded packages.
• Knowledge of wire bonding.
• Knowledge of SPC and JMP.
• Strong interpersonal and communication skills in English.
• Strong analytical, written communication and project management skills.

Responsibilities

• Design package, develop processes to qualify PQFN (Power Quad Flat-No lead) packages for SPS products & its associated modules.
• Ramp up manufacturing volume and qualify required sources.
• Responsible for line sustaining. Improve assembly yield, capacity, quality and costs.
• Address internal and external customer feedback / issues collaborating with Test / Product Engineers, Quality & Operations organization.
• Manage Product Lifecycle Management documents to the latest status.
• Conduct change-management with suppliers to sustain / improve capacity and cost.
• Partner with Quality and Reliability teams to meet internal, industry, and customer standards.
• Serve as the key manufacturing engineering interface for NPI-to-production transfers.
• Manage OSAT and contract manufacturing relationships supporting production.

Skills

Process engineering

Package development

Wire bonding

Quality & reliability

SPC

JMP

English proficiency

Project management

Education

Bachelor's degree in Mechanical, Materials, Physics, Chemistry or Applied Sciences

Tools

JMP

SPC software

Job description

Renesas Electronics in Malaysia seeks a manufacturing/packaging engineer to qualify PQFN packages for SPS products, scale up production, and improve assembly yield, cost and capacity. You will collaborate with Test, Product, Quality and Operations to address feedback and drive continuous improvements.

You will manage lifecycle documents, coordinate supplier changes, and support NPI-to-production transfers while ensuring adherence to quality and reliability standards in a fast-paced manufacturing