Staff Process Engineer

Aitomic Jobs; Ipoh; On-site; MYR 120,000 - 180,000; Full time

Job summary

Renesas Electronics in Malaysia is seeking a Staff Process Engineer to qualify and sustain Power QFN packaging and Cu Clip related thin die assembly processes. You will design packages and develop qualification methods for PQFN on SPS products, and ramp up manufacturing while securing sources.

The role requires hands-on experience in PQFN/QFN/WLCSP packaging, wire bonding, SPC analysis (JMP) and strong English communication.

Qualifications

• Degree in Mechanical, Materials, Physics, Chemistry or Applied Sciences.
• Experience in process engineering or package development of thin wafer handling and SPS solder attach processes.
• Knowledge in PQFN/QFN/WLCSP and leaded packages.
• Knowledge of wire bonding.
• Knowledge of SPC and JMP.

Responsibilities

• Qualify, Assembly Sustenance and Process Improvements on Power QFN package and Cu Clip related thin die assembly processes.
• Design package, develop processes to qualify PQFN (Power Quad Flat-No lead) packages for SPS (Smart Power Stage) products & its associated modules.
• Ramp up manufacturing volume and qualify required sources.
• Improve assembly yield, capacity, quality and costs.
• Address internal and external customer feedback / issues collaborating with Test / Product Engineers, Quality & Operations organization.
• Manage Product Lifecycle Management documents to the latest status.

Skills

Process engineering

Wire bonding

Statistical analysis

Interpersonal skills

English communication

Education

Bachelor's degree in Mechanical / Materials / Physics / Chemistry / Applied Sciences

Tools

JMP

SPC software

Job description

Short Summary

Staff Process Engineer with Renesas Electronics. Qualify, Assembly Sustenance and Process Improvements on Power QFN package and Cu Clip related thin die assembly processes. Key Responsibilities Design package, develop processes to qualify PQFN (Power Quad Flat-No lead) packages for SPS (Smart Power Stage) products & its associated modules. Ramp up manufacturing volume and qualify required sources. Responsible for line…

Key Details

• Position / opportunity: Staff Process Engineer
• Organization: Renesas Electronics
• Country / coverage: Malaysia
• Location: Ipoh, , Malaysia
• Work arrangement: On-site
• Opportunity type: Jobs
• Sector: Health
• Compensation: Not specified
• Duration: Not specified
• Start date: 2026-08-28
• Application deadline: Not specified

Description

Qualify, Assembly Sustenance and Process Improvements on Power QFN package and Cu Clip related thin die assembly processes. Key Responsibilities Design package, develop processes to qualify PQFN (Power Quad Flat-No lead) packages for SPS (Smart Power Stage) products & its associated modules. Ramp up manufacturing volume and qualify required sources. Responsible for line sustaining. Improve assembly yield, capacity, quality and costs. Address internal and external customer feedback / issues collaborating with Test / Product Engineers, Quality & Operations organization. Manage Product Lifecycle Management documents to the latest status. Conduct change-management with suppliers to sustain / improve capacity and cost. Partner with Quality and Reliability teams to meet internal, industry, and customer standards. Serve as the key manufacturing engineering interface for NPI-to-production transfers. Manage OSAT and contract manufacturing relationships supporting production. Degree in Mechanical, Material, Physics, Chemistry or Applied Sciences. Experienced in process engineering or package development of material/process/design of thin wafer handling and SPS solder attach processes. Knowledge in quality / reliability requirements of PQFNs/QFNs/WLCSP and leaded packages. Knowledge of wire bonding. Knowledge of SPC and statistical analysis software (such as JMP). Strong interpersonal and communication skills in English. Strong analytical, written communication and presentation skills. Able to manage large projects effectively. Nice to haves: Cu Clip, Thin Die, Power QFN Package development knowledge Experience transitioning products from Development to Production Experience supporting NPI to Mass Production Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier . With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future. At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives. We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process. Are you ready to join our team and shape the future with us? Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement .

Responsibilities

• Qualify, Assembly Sustenance and Process Improvements on Power QFN package and Cu Clip related thin die assembly processes.
• Key Responsibilities Design package, develop processes to qualify PQFN (Power Quad Flat-No lead) packages for SPS (Smart Power Stage) products & its associated modules.
• Ramp up manufacturing volume and qualify required sources.
• Improve assembly yield, capacity, quality and costs.
• Address internal and external customer feedback / issues collaborating with Test / Product Engineers, Quality & Operations organization.
• Manage Product Lifecycle Management documents to the latest status.

Requirements / Eligibility

• of PQFNs/QFNs/WLCSP and leaded packages.
• Knowledge of SPC and statistical analysis software (such as JMP).
• Strong interpersonal and communication skills in English.
• Strong analytical, written communication and presentation skills.
• Able to manage large projects effectively.