PQFN Process Engineer — SPS Packaging & NPI to Production

Renesas Electronics Corporation; Shah Alam; On-site; MYR 134,000 - 268,000; Full time

Job summary

Renesas Electronics Corporation in Malaysia is seeking a manufacturing engineer to qualify PQFN packages for SPS products and related modules. You will design packaging, develop qualification processes, and ramp up production while optimizing yield, capacity, quality, and cost.

You will collaborate with Test, Product, QA and Operations teams to address feedback, manage lifecycle documents, and coordinate with OSAT and contract manufacturers for smooth NPI-to-production transfers.

Qualifications

• Bachelor degree in Mechanical, Material, Physics, Chemistry or Applied Sciences.
• Experience in process engineering or package development of thin wafer handling and SPS solder attach processes.
• Knowledge of PQFNs/QFNs/WLCSP and leaded packages.
• Knowledge of wire bonding.
• Knowledge of SPC and JMP.
• Strong interpersonal and communication skills in English.
• Strong analytical, written communication and presentation skills. Able to manage large projects effectively.

Responsibilities

• Design package and develop processes to qualify PQFN (Power Quad Flat-No lead) packages for SPS (Smart Power Stage) products & its associated modules.
• Ramp up manufacturing volume and qualify required sources.
• Responsible for line sustaining. Improve assembly yield, capacity, quality and costs.
• Address internal and external customer feedback / issues collaborating with Test / Product Engineers, Quality & Operations organization.
• Manage Product Lifecycle Management documents to the latest status.
• Conduct change-management with suppliers to sustain / improve capacity and cost.
• Partner with Quality and Reliability teams to meet internal, industry, and customer standards.
• Serve as the key manufacturing engineering interface for NPI-to-production transfers
• Manage OSAT and contract manufacturing relationships supporting production

Skills

Process engineering

PQFN knowledge

Wire bonding

SPC

JMP

English fluency

Project management

Education

Degree in Mechanical, Material, Physics, Chemistry or Applied Sciences

Job description

Renesas Electronics Corporation in Malaysia is seeking a manufacturing engineer to qualify PQFN packages for SPS products and related modules. You will design packaging, develop qualification processes, and ramp up production while optimizing yield, capacity, quality, and cost.

You will collaborate with Test, Product, QA and Operations teams to address feedback, manage lifecycle documents, and coordinate with OSAT and contract manufacturers for smooth NPI-to-production transfers.