Staff Mold Engineer, Advanced Packaging & HVM

FusionAP; Penang; On-site; MYR 180,000 - 240,000; Full time

Job summary

FusionAP in Penang is seeking a Staff Engineer to act as technical authority for molding and encapsulation, driving development and manufacturing scale of mold encapsulation technologies to protect fragile silicon dies. You will lead DOE, SPC, material selection, and process optimization, collaborating with cross-functional teams in fast-paced production while ensuring environmental compliance and quality.

Experience in semiconductor packaging, 5+ years, and on-site availability in Penang are

Qualifications

• Bachelor’s degree or higher in engineering or related field.
• Hands-on experience with molding, encapsulation, and materials in packaging.
• Strong problem-solving and analytical skills are required.

Responsibilities

• Design and optimize mold processes for multi-chip modules.
• Lead DOE studies and SPC implementation to improve yield and process control.
• Evaluate materials and environmental compliance (e.g. RoHS) for EMCs.
• Troubleshoot equipment, clamping, transfer pressures, and cure profiles to ensure quality.
• Collaborate with cross-functional teams to support high-volume manufacturing and scale-up.

Skills

Semiconductor packaging

DOE / SPC

Root cause analysis

Cross-functional teamwork

Education

Bachelor’s degree or higher in Engineering

Job description

FusionAP in Penang is seeking a Staff Engineer to act as technical authority for molding and encapsulation, driving development and manufacturing scale of mold encapsulation technologies to protect fragile silicon dies. You will lead DOE, SPC, material selection, and process optimization, collaborating with cross-functional teams in fast-paced production while ensuring environmental compliance and quality.

Experience in semiconductor packaging, 5+ years, and on-site availability in Penang are