Mold Process Engineer: Elevate Yield & Quality

Renesas Electronics Corporation; Kuala Lumpur; On-site; MYR 90,000 - 150,000; Full time

Job summary

Renesas Electronics Corporation in Penang seeks a molding engineer to develop, optimize and control molding processes for high-quality products. You will collaborate with production, quality and maintenance to implement corrective actions and drive efficiency.

The role requires hands-on experience with transfer, compression or injection molding, strong problem-solving skills, and knowledge of DOE/Control Plans. Semiconductors packaging experience is preferred.

Qualifications

• Bachelor’s degree in Mechanical/Manufacturing/Materials/Chemical or Electrical Engineering.
• Experience with transfer molding, compression molding, or injection molding processes.
• Knowledge of DOE, SPC, FMEA, PFMEA, Control Plan, and problem-solving methodologies (8D, RCA, Six Sigma).
• Strong analytical and troubleshooting skills.

Responsibilities

• Develop and maintain process specifications, work instructions, FMEA, Control Plans, KPIV/KPOV, and troubleshooting guides.
• Support continuous improvement, cost reduction, automation, and productivity initiatives.
• Evaluate new mold compounds, mold tooling, and process technologies for reliability and manufacturability.
• Collaborate with equipment, quality, maintenance, and production teams to implement corrective and preventive actions for quality issues and customer complaints.
• Support new package and product qualifications, process transfers, and customer requirements.

Skills

Molding processes

Analytical troubleshooting

Process optimization

Cross-functional collaboration

Education

Bachelor's degree in Mechanical/Manufacturing/Materials/Chemical/Electrical Engineering

Tools

DOE

FMEA

PFMEA

Control Plans

Job description

Renesas Electronics Corporation in Penang seeks a molding engineer to develop, optimize and control molding processes for high-quality products. You will collaborate with production, quality and maintenance to implement corrective actions and drive efficiency.

The role requires hands-on experience with transfer, compression or injection molding, strong problem-solving skills, and knowledge of DOE/Control Plans. Semiconductors packaging experience is preferred.