Staff Process Engineer: Advanced Packaging & High-Volume

JAC Recruitment; Penang; On-site; MYR 120,000 - 180,000; Full time

Job summary

JAC Recruitment Malaysia seeks a Staff Process Engineer for a leading global semiconductor organization to drive PQFN packaging and high-volume manufacturing for power devices in Penang.

You will optimize assembly processes, improve yield and cost efficiency, and work with cross-functional teams and external partners to ensure robust production performance. Bachelor’s degree and semiconductor packaging experience required; strong SPC/data analysis skills and project management are essential.

Qualifications

• Bachelor's degree in Mechanical, Materials, Physics, Chemistry, or Applied Sciences.
• Proven semiconductor process engineering or advanced packaging experience.
• Experience with PQFN, QFN, WLCSP or similar package technologies.
• Knowledge of thin wafer handling, die attach and Cu clip assembly.
• Familiar with SPC and data analysis tools (e.g., JMP).
• Strong problem-solving, analytical and project management skills.
• Excellent cross-functional collaboration and communication.

Responsibilities

• Lead package development and process qualification for PQFN and SPS.
• Develop and optimise assembly processes for thin wafer handling, die attach, Cu clip.
• Drive high-volume manufacturing ramp-up and supplier qualification.
• Own sustaining engineering to improve yield, quality, capacity and cost.
• Collaborate with Product, Test, Quality, and Operations to resolve issues.
• Lead root cause analysis and implement corrective actions.
• Manage PLM documentation for accuracy and compliance.
• Drive supplier change management to improve robustness and cost.

Skills

Semiconductor process engineering

SPC / data analysis

Project management

Problem solving

Team collaboration

Communication

Education

Bachelor's degree in Mechanical, Materials, Physics, Chemistry, or Applied Sciences

Tools

JMP

Job description

JAC Recruitment Malaysia seeks a Staff Process Engineer for a leading global semiconductor organization to drive PQFN packaging and high-volume manufacturing for power devices in Penang.

You will optimize assembly processes, improve yield and cost efficiency, and work with cross-functional teams and external partners to ensure robust production performance. Bachelor’s degree and semiconductor packaging experience required; strong SPC/data analysis skills and project management are essential.