Mold Staff Engineer

FusionAP; Penang; On-site; MYR 180,000 - 240,000; Full time

Job summary

FusionAP in Penang is seeking a Staff Engineer to act as technical authority for molding and encapsulation, driving development and manufacturing scale of mold encapsulation technologies to protect fragile silicon dies. You will lead DOE, SPC, material selection, and process optimization, collaborating with cross-functional teams in fast-paced production while ensuring environmental compliance and quality.

Experience in semiconductor packaging, 5+ years, and on-site availability in Penang are

Qualifications

• Bachelor’s degree or higher in engineering or related field.
• Hands-on experience with molding, encapsulation, and materials in packaging.
• Strong problem-solving and analytical skills are required.

Responsibilities

• Design and optimize mold processes for multi-chip modules.
• Lead DOE studies and SPC implementation to improve yield and process control.
• Evaluate materials and environmental compliance (e.g. RoHS) for EMCs.
• Troubleshoot equipment, clamping, transfer pressures, and cure profiles to ensure quality.
• Collaborate with cross-functional teams to support high-volume manufacturing and scale-up.

Skills

Semiconductor packaging

DOE / SPC

Root cause analysis

Cross-functional teamwork

Education

Bachelor’s degree or higher in Engineering

Job description

Company Description FusionAP is a semiconductor engineering company founded by professionals with deep expertise in advanced packaging technologies. The company is focused on delivering world-class advanced packaging solutions to global customers while building Malaysia’s first high-value, next-generation packaging hub. FusionAP emphasizes innovation through engineering excellence and strategic partnerships across the semiconductor ecosystem. The organization actively supports national priorities in AI, automotive, and high-performance computing, offering team members opportunities to contribute to cutting-edge applications. Joining FusionAP means working in a growth-oriented environment committed to technical leadership and industry impact.

Role Description Role Summary The rapid expansion of RF in smartphones has positioned System Integrated Packaging and multi-die chiplet packaging as critical differentiators in semiconductor

manufacturing. We are seeking a highly capable Staff Engineer to be the technical authority for our advanced molding and encapsulation modules. In this role, he will lead the development and high-volume manufacturing (HVM) scaling of mold encapsulation technologies designed to protect fragile silicon dies and fine-pitch interconnects from thermomechanical stress. Operating at the intersection of polymer chemistry, rheology, and mechanical engineering, you will drive breakthrough process solutions for next-generation advanced packaging.

Key Responsibilities

• 1)Process Development: Design, evelop, optimize, and transfer the mold processes recipes and post mold grinding process for strip based or unit based with multi-chip modules for both single sided or double sided mold configurations
• 2)Material Selection & Characterization: Evaluate and qualify advanced Epoxy Molding Compounds (EMC) to ensure environmental compliance (e.g. RoHS), will optimize material properties such as filler size, viscosity, cure kinetics, and coefficient of thermal expansion (CTE) to ensure compatibility with fragile silicon and minimize package warpage. He will create and optimize mold grinding recipes to balance customer requirements while preventing quality issues.
• 3) Yield & Defect Mitigation: Apply rigorous root cause failure analysis (RCFA) to identify and eliminate molding defects such as incomplete fill, voiding, interfacial delamination, resin bleed, and die cracking. You will utilize advanced metrology, including Scanning Acoustic Microscopy (C-SAM), X rays and cross-sectional analysis to drive effective defect detection and root cause analysis.
• Tooling & Equipment Engineering: Drive the design and optimization of mold chases and tooling. You will program and calibrate state-of-the-art molding equipment, strictly controlling critical parameters such as clamping force, transfer pressure, vacuum levels, and dynamic cure temperature profiles.
• Experimental Rigor & Scaling: Design and execute complex, multi-factor Designs of Experiments (DOE) to establish wide process windows implement Statistical Process Control (SPC) methodologies and define Control Plans and Process Failure Mode and Effects Analyses (pFMEAs) to improve early signal detection for sustainable quality controls.

Qualifications

• Strong knowledge of semiconductor packaging processes, especially molding, encapsulation, and related materials and equipment.
• 5+ years of hands on experience with process engineering, including DOE, statistical process control, and root cause analysis for yield and quality improvement.
• Familiarity with manufacturing operations, including production line support, equipment troubleshooting, and continuous improvement methodologies.
• Ability to interpret technical drawings, process specifications, and customer requirements in advanced packaging applications.
• Bachelor’s degree or higher in Engineering (e.g., Mechanical, Materials, Chemical, Electrical, or related field) or equivalent practical experience.
• Effective communication and collaboration skills, with the ability to work in cross-functional teams and a fast-paced production environment.
• Strong problem-solving mindset, attention to detail, and commitment to safety and quality standards.
• Prior experience in semiconductor manufacturing, advanced packaging, or assembly and test environments is highly beneficial.
• Willingness to work on-site in Penang and support occasional off-shift or weekend activities as required by production needs.