Staff Engineer - Die & Layer Attach Process Innovation

OSRAM Opto Semiconductors (Malaysia) Sdn. Bhd., Penang

Bayan Lepas

On-site

MYR 80,000 - 120,000

Full time

2 days ago

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Job summary

ams OSRAM Opto Semiconductors in Penang invites a Die Attach/Layer Attach Process Development Staff Engineer to join our electronics manufacturing team. You will support NPI, develop processes, optimize equipment, and collaborate with cross-functional teams.

The role requires a Bachelor's in Engineering and 2+ years in semiconductor Die Attach/Layer Attach, with hands-on process development, data analytics, and familiarity with Excel and JMP. This is a growth opportunity in Bayan Lepas.

Qualifications

Bachelor's Degree in Engineering or equivalent.
More than 2 years in semiconductor Die Attach/Layer Attach process engineering.
Die Attach, Layer Attach process knowledge in semiconductors or LED manufacturing.
Experience in Process development or New Product Introduction is a plus.
Hands-on experience in FOL related processes (sawing, die attach, wire bond).
Strong analytical and problem solving skills; Six Sigma knowledge preferred.
Proficiency with MS Excel, Word, PowerPoint and JMP.

Responsibilities

Support New Product Introduction (NPI) and deliver process/equipment solutions.
Drive sourcing resilience and cost optimization for equipment.
Lead or contribute to solving manufacturing process challenges to improve yield and cost.
Provide technical leadership in cross functional problem solving teams.
Maintain and enhance technical competency with design rules, process know-how, and supplier technologies.