Die Attach Process Lead: Quality, Yield & Optimization

OSRAM Opto Semiconductors (Malaysia) Sdn Bhd; Bayan Lepas; On-site; MYR 70,000 - 110,000; Full time

Job summary

OSRAM Opto Semiconductors (Malaysia) Sdn Bhd is seeking a Process Engineer focused on die attach to maintain and improve quality cases and yield performance. You will act as the process owner to govern control documentation and drive improvements across where material usage and wastage are monitored.

The role requires collaboration with Product Development, Process Integration, and related teams for new product setups and proper handover, while supporting internal and customer audits and

Qualifications

• Experience in die attach processes and manufacturing yield improvements.
• Strong written and verbal communication skills.
• Basic understanding of statistics and Lean Six Sigma concepts.

Responsibilities

• Maintain and improve quality cases, maverick and yield performance.
• Act as process owner to govern and improve process control and documentation.
• Monitor direct and indirect material usage, consumption and wastage control.
• Support internal and customer audits and respond to audit findings.
• Lead productivity improvements and capacity extensions.
• Collaborate with Product Development, PI, PO and BT for new product/process setup and handover.

Skills

Die attach process engineering

Communication skills

Statistical analysis / Lean 6 Sigma

Education

Bachelor or Master in Engineering / Material

Job description

OSRAM Opto Semiconductors (Malaysia) Sdn Bhd is seeking a Process Engineer focused on die attach to maintain and improve quality cases and yield performance. You will act as the process owner to govern control documentation and drive improvements across where material usage and wastage are monitored.

The role requires collaboration with Product Development, Process Integration, and related teams for new product setups and proper handover, while supporting internal and customer audits and