Die/Layer Attach Process Development Staff Engineer

OSRAM Opto Semiconductors (Malaysia) Sdn. Bhd., Penang; Bayan Lepas; Presencial; MYR 80 000 - 120 000; Tempo integral

Resumo da oferta

ams OSRAM Opto Semiconductors in Penang invites a Die Attach/Layer Attach Process Development Staff Engineer to join our electronics manufacturing team. You will support NPI, develop processes, optimize equipment, and collaborate with cross-functional teams.

The role requires a Bachelor's in Engineering and 2+ years in semiconductor Die Attach/Layer Attach, with hands-on process development, data analytics, and familiarity with Excel and JMP. This is a growth opportunity in Bayan Lepas.

Qualificações

• Bachelor's Degree in Engineering or equivalent.
• More than 2 years in semiconductor Die Attach/Layer Attach process engineering.
• Die Attach, Layer Attach process knowledge in semiconductors or LED manufacturing.
• Experience in Process development or New Product Introduction is a plus.
• Hands-on experience in FOL related processes (sawing, die attach, wire bond).
• Strong analytical and problem solving skills; Six Sigma knowledge preferred.
• Proficiency with MS Excel, Word, PowerPoint and JMP.

Responsabilidades

• Support New Product Introduction (NPI) and deliver process/equipment solutions.
• Drive sourcing resilience and cost optimization for equipment.
• Lead or contribute to solving manufacturing process challenges to improve yield and cost.
• Provide technical leadership in cross functional problem solving teams.
• Maintain and enhance technical competency with design rules, process know-how, and supplier technologies.

Conhecimentos

Analytical skills

Problem solving

Six Sigma knowledge

Process development

NPI experience

Formação académica

Bachelor's Degree in Engineering (Mechanical/Mechatronic/ Electromechanical) or equivalent

Ferramentas

Microsoft Excel

PowerPoint

Word

JMP

Descrição da oferta de emprego

Career Opportunities: Die/Layer Attach Process Development Staff Engineer (24642)

Requisition ID24642-Posted10/21/2026

The ams OSRAM Group is a global leader in innovative light and sensor solutions. With more than 110 years of industry experience, we combine engineering excellence and global manufacturing with a passion for cutting-edge innovation enabling transformative advancements in the automotive, industrial, medical, and consumer industries. “Sense the power of light” – our success is based on the deep understanding of the potential of light and distinct portfolio of emitter and sensor technologies. Around 19,700 employees worldwide drive innovations alongside societal megatrends. Find out more about us on https://ams-osram.com

The ams OSRAM Opto Semiconductors business offers high-performance opto semiconductor components and in-depth support for state-of-the-art system solutions based on innovative semiconductor light sources. The Business Unit can look back on almost fifty years of production and development expertise.

Your new responsibilities

• Support New Product Introduction (NPI), deliver assigned process and equipment development solutions that meet or exceed project quality, cost and timeline targets to ensure successful product industrialization.
• Drive Equipment Dual Sourcing & Cost Optimization. Establish qualified second-source equipment suppliers and introduce cost-effective processes or technologies to achieve equipment sourcing resilience and cost-saving objectives. Aligned with equipment strategy and manufacturing readiness requirements. Drive continuous process improvement initiatives focused on BOM material optimization and UPH (Units Per Hour) enhancement to achieve product cost targets while maintaining quality and operational efficiency.
• Resolve Chronic Technical Issues through Innovation. Lead or contribute to the resolution of recurring manufacturing and process challenges by applying innovative, data-driven, and out-of-the-box engineering solutions to improve yield, reliability, productivity, and cost performances.
• Contribute to Cross-Functional Problem Solving. Provide active technical leadership, analysis, and support in team-based problem-solving initiatives (e.g., Focus Teams, Task Forces, Problem Solving Team, Yield Improvement Projects, and Customer Issue Investigations) to ensure timely and sustainable issue resolution.
• Develop and Maintain Technical Competency. Continuously enhance technical expertise by maintaining and updating organizational knowledge relating to:
  • Design guidelines and design rules
  • Process know-how and best practices
  • Equipment capabilities and supplier technologies
  • Knowledge management systems and lessons learned
• Actively participate in internal and external knowledge-sharing activities, including technical symposiums, conferences, benchmarking sessions, trade shows, and engineering forums to strengthen organizational capability and innovation culture. This aligns with internal expectations for maintaining technical knowledge and sharing expertise across the organization

What we look for

• Bachelor's Degree in Engineering (Mechanical/ Mechatronic/ Electromechanical), Engineering (Material Science), Physics or equivalent.
• More than 2 years in semiconductor Die Attach/Layer Attach process engineering field.
• Die Attach, Layer Attach process engineering knowledge & hands on skillset in semiconductors or LED manufacturing processes.
• Experience in Process development or New Product Introduction would be an advantage.
• Hands-on and process development experience in FOL related processes e.g. sawing, die attach and wire bond process.
• Strong analytical skill, systematic problem solving approach skill, statistical knowledge with knowledge of Six Sigma is preferred.
• An in-depth knowledge of Microsoft Excel, Word, PowerPoint and JMP is required.