Signal Integrity Engineer

UST; Penang; On-site; MYR 60,000 - 120,000; Full time

Job summary

UST in Penang is seeking an Electronics Simulation Engineer to lead HSIO/HSSI/GPIO modeling using Ansys HFSS, DoE studies, and measurement-to-simulation correlation. You will build 3D EM models of packages and PCBs, generate Touchstone and 3D model files, and prepare comprehensive design guidance.

The role emphasizes data-driven analysis, full-channel simulations, IBIS model validation, and documentation integrity.

Qualifications

• 1–3 years of experience in electromagnetic simulation and signal integrity.
• Bachelor’s degree in Electronic Engineering or related field.
• Strong interest in electronics, circuit design, power delivery networks, and signal integrity.

Responsibilities

• Perform 3D EM simulations using Ansys HFSS for package and PCB board model extraction.
• Conduct DoE studies and provide design recommendations to meet requirements.
• Perform measurement-to-simulation correlation to validate results.
• Consolidate simulation results with frequency- and time-domain plots.
• Prepare and maintain simulation deliverables including 3D models, Touchstone files, and documentation.
• Perform DoE-based passive modelling and full-channel simulations with collateral generation.
• Generate IBIS models and validate with AC/DC checks.
• Maintain organized simulation projects, setup files, and reporting templates.
• Manage lab equipment, perform TDR and VNA measurements for correlation.
• Deliver simulation models and reports according to project specifications and Intel templates.

Skills

HFSS simulations

DoE studies

Measurement correlation

IBIS modeling

Documentation & reporting

TDR/VNA measurements

PCB design knowledge

Education

Bachelor’s Degree in Electronic Engineering

Tools

Ansys HFSS

IBIS model tools

VNA/TDR equipment

Job description

Job Description:

1. HSIO Simulation & Model Extraction

• Perform 3D electromagnetic (EM) simulations using Ansys HFSS for package and PCB board model extraction.
• Conduct Design of Experiments (DoE) studies and provide design recommendations to meet package and PCB design requirements.
• Perform measurement-to-simulation correlation to validate simulation accuracy.
• Consolidate and present simulation results using frequency-domain and time-domain plots.
• Prepare and maintain proper technical documentation, including:

3D model files and Touchstone files.

Clear documentation and guidelines on Touchstone file usage.

Simulation results, design recommendations, and correlation reports.

2. HSSI Simulation & Model Extraction

• Perform 3D electromagnetic (EM) simulations using Ansys HFSS for package and PCB board model extraction.
• Conduct DoE studies to evaluate design options and provide recommendations to meet high-speed interface design requirements.
• Perform measurement-to-simulation correlation to validate simulation results.
• Analyze and consolidate simulation data, presenting results in both frequency and time domains.
• Prepare and maintain simulation deliverables, including:
• 3D model files and Touchstone files.
• Documentation describing model setup, file usage, and simulation methodology.
• Consolidated simulation reports and design recommendations.

3. GPIO Simulation & Reporting

• Perform GPIO-related simulation analysis and generate the following reports:
• DQ Group and LVDS Pair Skew Control Report.
• LVDS CLKIN NEXT Report.
• EMIF NEXT, FEXT, and Insertion Loss Report.
• DCR Report.
• Save and maintain all simulation setup files in a structured folder for traceability and reuse.

4. DOE Passive Modelling & Full-Channel Simulation

• Perform DoE-based passive modelling and full-channel simulations.
• Generate and maintain simulation collateral, including .cir, .tab, and .sp files, as applicable.
• Analyze simulation results against defined design requirements.
• Identify and report passing and failing results.Perform root-cause analysis and optimize the design to address simulation failures.
• Consolidate and deliver simulation results in accordance with Intel reporting templates and requirements.

5. IBIS Model Generation & Validation

• Generate IBIS models from netlist-based models.
• Perform AC and DC correlation checks to validate the generated IBIS models.
• Analyze correlation results, identify discrepancies, and support model optimization where required.
• Prepare and maintain model validation reports and supporting documentation.

6. Documentation & Deliverables

• Maintain organized simulation projects, setup files, model files, and supporting collateral.
• Ensure simulation results are clearly documented, traceable, and reproducible.
• Prepare technical reports and presentations summarizing simulation methodology, results, correlation findings, and design recommendations.
• Deliver simulation models and reports according to project specifications and applicable Intel templates.

7. For Lab

• Manage lab equipment and inventory
• Perform TDR and VNA measurement for simulation correlation
• Collect actual data from bare PCB samples for analysis
• Collect shipment package from receiving department

Job Requirements:

• Has 1-3yrs experience in this field.
• Bachelor’s Degree in Electronic Engineering or a closely related discipline.
• Strong interest in electronics, circuit design, power delivery networks, and signal/power integrity.
• Good analytical, problem-solving, and communication skills.
• Willingness to learn new simulation tools and engineering methodologies.