Signal Integrity Engineer — 3D EM, IBIS Modeling & SI Diagnostics

UST; Penang; Sur place; MYR 60 000 - 120 000; Plein temps

Résumé du poste

UST in Penang is seeking an Electronics Simulation Engineer to lead HSIO/HSSI/GPIO modeling using Ansys HFSS, DoE studies, and measurement-to-simulation correlation. You will build 3D EM models of packages and PCBs, generate Touchstone and 3D model files, and prepare comprehensive design guidance.

The role emphasizes data-driven analysis, full-channel simulations, IBIS model validation, and documentation integrity.

Qualifications

• 1–3 years of experience in electromagnetic simulation and signal integrity.
• Bachelor’s degree in Electronic Engineering or related field.
• Strong interest in electronics, circuit design, power delivery networks, and signal integrity.

Responsabilités

• Perform 3D EM simulations using Ansys HFSS for package and PCB board model extraction.
• Conduct DoE studies and provide design recommendations to meet requirements.
• Perform measurement-to-simulation correlation to validate results.
• Consolidate simulation results with frequency- and time-domain plots.
• Prepare and maintain simulation deliverables including 3D models, Touchstone files, and documentation.
• Perform DoE-based passive modelling and full-channel simulations with collateral generation.
• Generate IBIS models and validate with AC/DC checks.
• Maintain organized simulation projects, setup files, and reporting templates.
• Manage lab equipment, perform TDR and VNA measurements for correlation.
• Deliver simulation models and reports according to project specifications and Intel templates.

Connaissances

HFSS simulations

DoE studies

Measurement correlation

IBIS modeling

Documentation & reporting

TDR/VNA measurements

PCB design knowledge

Formation

Bachelor’s Degree in Electronic Engineering

Outils

Ansys HFSS

IBIS model tools

VNA/TDR equipment

Description du poste

UST in Penang is seeking an Electronics Simulation Engineer to lead HSIO/HSSI/GPIO modeling using Ansys HFSS, DoE studies, and measurement-to-simulation correlation. You will build 3D EM models of packages and PCBs, generate Touchstone and 3D model files, and prepare comprehensive design guidance.

The role emphasizes data-driven analysis, full-channel simulations, IBIS model validation, and documentation integrity.