Staff Engineer Unit Process Development Wire Bond

Infineon Technologies; Malacca City; On-site; MYR 180,000 - 300,000; Full time

Job summary

Infineon Technologies in Malaysia is seeking a Staff Engineer for Unit Process Development Wire Bond to drive advanced packaging processes. You will lead development activities, optimize wire bond steps, and ensure robust, manufacturable solutions across product lines.

The role requires hands-on expertise with ASM and Shinkawa equipment, strong problem-solving skills, and experience with DMAIC, FMEA, DOE, and statistical analysis to support new product introductions and process improvements.

Qualifications

• Master’s or Bachelor’s Degree in Engineering or related discipline
• >5 years of experience in semiconductor manufacturing, preferably in assembly process development
• Hands-on experience in wire bond processes including ASM and Shinkawa equipment
• Proven problem-solving and root cause analysis using DMAIC, 8D, FMEA, and statistics
• Knowledge of analytical and failure analysis techniques with data interpretation
• Proficiency in DOE, process capability, and statistical data analysis
• Strong communication and collaboration across cross-functional and global teams

Responsibilities

• Serve as unit process expert in development projects, supporting milestones through process development, characterization, tooling design reviews, and equipment release activities
• Lead qualification and verification of new materials, tooling, and equipment for new product introductions and technology deployments
• Support prototype and customer sample builds, drive process optimization, troubleshooting, and risk mitigation
• Own and maintain process documentation (PFDs, PFMEA, DFMEA, OJTI, T32, PDR)
• Ensure effective handover to Operations for manufacturing readiness and sustaining production
• Collaborate with cross-functional teams and suppliers to deliver robust, cost-effective process solutions

Job description

#WeAreIn for jobs that impact everyone's life.

Join the thinkers, builders, and problem-solvers behind tomorrow’s technology.

As a Staff Engineer Unit Process Development Wire Bond in our Research & Development team, you'll have the

opportunity to merge creativity with your technical expertise by shaping the future of technology, driving groundbreaking projects, and bringing new ideas to life.

Are you in?

Your role

Key responsibilities in your new role

• Serve as the unit process expert in development projects, supporting milestone achievement through process development, characterization, tooling design reviews, and T32 equipment release activities.
• Lead the qualification and verification of new materials, tooling, and equipment to support new product introductions and technology deployments.
• Support prototype and customer sample builds while driving process optimization, troubleshooting, and risk mitigation activities.
• Own and maintain process documentation, including Process Specifications, PFMEA, DFMEA, OJTI, T32, and Process Development Reports (PDR).
• Ensure effective technical handover and knowledge transfer to Operations to support manufacturing readiness and sustaining production activities.
• Collaborate with cross-functional teams and suppliers to deliver robust, manufacturable, and cost-effective process solutions.

Your profile

Qualifications And Skills To Help You Succeed

• Master’s or Bachelor’s Degree in Engineering or a related discipline, with more than 5 years of experience in semiconductor manufacturing, preferably in assembly process development.
• Strong hands-on experience and technical expertise in wire bond processes, including ASM and Shinkawa equipment platforms.
• Proven problem-solving and root cause analysis capabilities utilizing structured methodologies such as DMAIC, 8D, FMEA, and statistical analysis.
• Knowledge of analytical and failure analysis techniques, including the interpretation of data from relevant characterization and inspection equipment.
• Proficiency in statistical data analysis, process capability evaluation, and Design of Experiments (DOE) for process optimization and qualification activities.
• Strong communication and collaboration skills, with the ability to work effectively across cross-functional and global teams.

#WeAreIn for driving decarbonization and digitalization.

As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.

Are you in?

We are on a journey to create the best Infineon for everyone.

We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity.

Our hiring decisions are based on skills and experience. Even if you don’t meet every requirement, we encourage you to apply.

Please let your recruiter know if you need any accommodations during the interview process.

Learn more about our various contact channels and about Diversity & Inclusion at Infineon.