Senior Tooling Engineer (Mold Maintenance / Injection Molding)

Carsem (M) Sdn. Bhd; Ipoh; On-site; MYR 90,000 - 130,000; Full time

Job summary

Carsem (M) Sdn. Bhd. seeks a Senior Tooling Engineer to oversee mold tooling PM, refurbishment, and part installation in a fast-paced semiconductor manufacturing setting.

You will monitor tool life, inspect samples, and drive CAPA across daily mold tooling issues. Proficiency in 3D CAD and reading complex drawings is essential. Ideal candidates hold a Bachelor’s in mechanical/electrical/mechatronic fields with 5+ years relevant experience and strong problem-solving, communication, and teamwork

Qualifications

• Bachelor's degree in Mechanical, Electrical/Electronic, Mechatronic Engineering or related with at least 5 years of relevant experience.
• Strong problem-solving, analytical, and troubleshooting skills.
• Good communication and teamwork skills.
• Self-motivated, proactive, and able to work effectively in a fast-paced production environment.

Responsibilities

• Coordinate technicians on mold tooling preventive maintenance (PM), verify measurement data, review PM reports and checklists, and approve PM completion.
• Support mold refurbishment activities, install new mold parts, conduct sample trials, and perform visual and dimensional inspections.
• Monitor tool life for critical mold components, perform periodic audits, and investigate any tool life issues.
• Coordinate the resolution of daily mold tooling issues, investigate and implement CAPA.
• Generate 3D models and drawings using CAD software.
• Coordinate special projects related to mold tooling and mold equipment.
• Follow up and resolve mold equipment-related issues.

Skills

Technical Drawing Interpretation

Electro-Mechanical & Pneumatic Systems

Failure Analysis & Root Cause Investig

3D CAD software

Education

Bachelor's degree in Mechanical, Electrical/Electronic, Mechatronic Engineering

Job description

Senior Tooling Engineer (Mold Maintenance / Injection Molding)

Coordinate technicians on mold tooling preventive maintenance (PM), verify measurement data, review PM reports and checklists, and approve PM completion.

Support mold refurbishment activities, install new mold parts, conduct sample trials, and perform visual and dimensional inspections.

Monitor tool life for critical mold components, perform periodic audits, and investigate any tool life issues.

Coordinate the resolution of daily mold tooling issues, conduct investigations, and implement corrective and preventive actions (CAPA).

Generate 3D models and drawings using CAD software.

Coordinate special projects related to mold tooling and mold equipment.

Follow up and resolve mold equipment-related issues.

Special Skills

Technical Drawing Interpretation – Able to read and understand machine manuals, technical drawings, circuit diagrams, and troubleshooting guides.

Electro-Mechanical & Pneumatic Systems – Knowledge of motors, actuators, vacuum systems, and pressure control systems.

Failure Analysis & Root Cause Investigation – Ability to identify equipment issues and determine root causes to prevent recurrence.

Proficient in 3D CAD software for generating 3D models and drawings.

Requirements

Bachelor's Degree in Mechanical, Electrical/Electronic, Mechatronic Engineering, or a related discipline with at least 5 years of relevant experience, preferably in a semiconductor manufacturing environment.

Strong problem-solving, analytical, and troubleshooting skills.

Good communication and teamwork skills.

Self-motivated, proactive, and able to work effectively in a fast-paced production environment.

Consumer Electronics Manufacturing More than 10,000 employees

Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest range package & test portfolios in the world.

Founded in 1972, Carsem is among the most experienced companies in our industry and is recognized as one of the largest in unit volume production. We have over 6,000 employees and ship in excess of 100 million units each week and more than 65% of this volume is shipped as fully tested product. Carsem is a member of one of South East Asia's most successful corporations, the Hong Leong Group, who views semiconductors as a core business.

We have three high technology factories. Two are located in Ipoh, Malaysia, and a new third factory is located in Suzhou, China. The two factories in Malaysia, Carsem - M Site and Carsem - S Site, are 10 miles (16Km) apart. Ipoh is a 90 minute drive from Penang and 2.5 hours from Kuala Lumpur.

The factories are supported by extensive R&D and failure analysis staff and incorporate highly sophisticated, "state of the art" automated equipment, ensuring quality products which meet the exacting standards of all the automotive, telecom, computer and consumer goods industries. Both factories maintain world-class quality standards having achieved ISO/TS 16949, ISO-9001, ISO-14001 certifications and comply to the Sony Green Partner Program. They are supported with a global network of sales and technical support offices. The China factory, Carsem-Suzhou Ltd., is located in the province of Jiangsu, 50 miles (80Km) west of Shanghai. The new factory is 172K sq. ft. (16K sq. m.) and is on 645K sq. ft. (60K sq. m.) of land in the Suzhou Industrial Park. The construction was completed in January 2004, the staff has been through extensive training in Carsem's existing Malaysian factories and the assembly and test equipment to support the manufacture of the MLP (Micro Leadframe Package) Quad and Dual was installed during the second quarter of 2004. Customer qualifications were completed during the second quarter and the factory started shipping production volumes during the third quarter of 2004.

Product & Services

Product Groups Assembled at M Site: MLP MICRO I.C. PDIP (300/600 Mil), PLCC, SOIC (150Mil), MSOP (3.0mm), QSOP (150Mil) MICRO SOT 23, SOT66x, TSOT, SOT, TO92; SC 70 POWER TO220, DDPAK, SOT223 S Site

S Site commenced operations in April,1992. The factory has a total floor space of 384,000 sq. ft. (35,700 M2), a work force of 4,300 employees and the ability to expand by 270,000 sq. ft. (25,000 M2) in the future. Product Groups Assembled at S Site: MLP QUAD, DUAL ARRAY SSBGA, SSLGA, FTBGA, CBGA I.C. PDIP (300 Mil), PLCC, SOIC (150/300 Mil), QSOP (300 Mil), SSOP (5.3mm), TSSOP (4.4/ 6.1mm) QFP MQFP, LQFP, TQFP SiP System in Package

Other Information

VISION

"To be a World Class Company Offering Assembly, Test/Finishing Solutions to Semiconductor Companies Throughout the World"

MISSION

"Carsem will Continue to show Profitable Growth with Emphasis on Employee Development and Operational and Service Indices to Ensure that we are the Employer Of Choice and Supplier Of Choice"

QUALITY

Carsem's policy is to provide products and services of the highest quality through "ZERO DEFECTS TODAY!", preventive Quality culture. Employees will act with honesty, sincerity and operate as a team to continuously strive for improvements in quality, productivity, delivery, services and cost in order to be competitive and profitable. ZERO DEFECTS QUALITY is the responsibility of every employee.

PERSONAL DATA PROTECTION

The Hong Leong Group use personal data in accordance with the Hong Leong Group Privacy Notice for new applicants which can be found (http://www.hongleong.com.my).

• Medical Education support Dental Parking Medical for immediate family members, car subsidy