Maintenance Section Head (Metal Finishing)

Carsem (M) Sdn. Bhd; Ipoh; On-site; MYR 120,000 - 180,000; Full time

Benefits offered by this job

Medical Education support

Dental

Parking

Medical for immediate family members

Car subsidy

Job summary

Carsem (M) Sdn. Bhd is seeking a Maintenance Section Head for Metal Finishing to oversee plating, anodizing, and coating lines, ensuring high equipment uptime and OEE targets.

You will develop PM and PdM programs, drive MTTR/MTBF improvements, and lead safety, cost control, and process support initiatives across the facility. The role requires a strong leadership background, 5+ years in semiconductor manufacturing maintenance, and hands-on experience with electroplating and chemical handling.

Qualifications

• Bachelor's degree in relevant engineering/chemistry field.
• Minimum 5 years semiconductor manufacturing experience, including at least 2 years in maintenance engineering.
• Metal finishing/plating experience preferred.
• Hands-on experience in electroplating, chemical handling, and equipment troubleshooting.
• Electrical license is an added advantage; strong leadership and communication skills.

Responsibilities

• Develop, implement, and improve PM and PdM programs for critical equipment.
• Drive improvements in MTTR and MTBF.
• Enforce safety procedures related to chemical handling, confined spaces, and LOTO.
• Manage maintenance budgets and control repair & maintenance costs.
• Optimize inventory levels of critical spare parts; manage vendors for quality services.
• Lead equipment improvement projects to boost productivity, quality, and cost efficiency.
• Train technicians in mechanical, electrical, and PLC troubleshooting.
• Set team KPIs, conduct performance reviews, and promote accountability.
• Drive 5S practices for a safe, organized workplace.

Skills

Leadership

Analytical thinking

Problem-solving

Maintenance engineering

Electroplating

Chemical handling

Equipment troubleshooting

Education

Bachelor's degree in Mechanical, Electrical/Electronics, Mechatronics, Chemistry, Chemical Engineering, or related field

Tools

PLC

Job description

Maintenance Section Head (Metal Finishing)

Ensure high equipment uptime and achieve OEE targets for metal finishing lines (plating, anodizing, coating) by minimizing breakdowns.

Develop, implement, and improve Preventive Maintenance (PM) and Predictive Maintenance (PdM) programs for critical equipment.

Drive improvements in MTTR (Mean Time to Repair) and MTBF (Mean Time Between Failures).

2. Environmental, Health & Safety (EHS)

Enforce safety procedures related to chemical handling, confined spaces, and Lockout/Tagout (LOTO).

Ensure reliable operation of WWTP, fume scrubbers, and exhaust systems to meet environmental regulations.

Maintain maintenance, calibration, and safety records to support audit readiness.

3. Cost Control & Spare Parts Management

Manage maintenance budgets and control repair & maintenance costs.

Optimize inventory levels of critical spare parts to ensure availability while minimizing excess stock.

Manage vendors and contractors to ensure quality and cost-effective services.

4. Quality & Process Support

Ensure process-critical equipment is properly calibrated and maintained to support product quality.

Conduct root cause analysis and work with Process and Quality teams to resolve equipment-related issues.

Lead equipment improvement and upgrade projects to enhance productivity, quality, and cost efficiency.

Train and develop technicians in mechanical, electrical, and PLC troubleshooting.

Set team KPIs, conduct performance reviews, and promote accountability.

Drive 5S practices to maintain a safe, organized, and efficient workplace.

Requirements

Bachelor's Degree in Mechanical, Electrical/Electronics, Mechatronics, Chemistry, Chemical Engineering, or related field.

Minimum 5 years of semiconductor manufacturing experience, including at least 2 years in maintenance engineering; metal finishing/plating experience preferred.

Hands‑on experience in electroplating processes, chemical handling, and equipment troubleshooting.

Electrical license is an added advantage.

Strong leadership, analytical, and problem‑solving skills.

Good communication, teamwork, and follow‑up skills.

Consumer Electronics Manufacturing More than 10,000 employees

Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest range package & test portfolios in the world.

Founded in 1972, Carsem is among the most experienced companies in our industry and is recognized as one of the largest in unit volume production. We have over 6,000 employees and ship in excess of 100 million units each week and more than 65% of this volume is shipped as fully tested product. Carsem is a member of one of South East Asia's most successful corporations, the Hong Leong Group, who views semiconductors as a core business.

We have three high technology factories. Two are located in Ipoh, Malaysia, and a new third factory is located in Suzhou, China. The two factories in Malaysia, Carsem - M Site and Carsem - S Site, are 10 miles (16Km) apart. Ipoh is a 90 minute drive from Penang and 2.5 hours from Kuala Lumpur.

The factories are supported by extensive R&D and failure analysis staff and incorporate highly sophisticated, "state of the art" automated equipment, ensuring quality products which meet the exacting standards of all the automotive, telecom, computer and consumer goods industries. Both factories maintain world‑class quality standards having achieved ISO/TS 16949, ISO‑9001, ISO‑14001 certifications and comply to the Sony Green Partner Program. They are supported with a global network of sales and technical support offices. The China factory, Carsem-Suzhou Ltd., is located in the province of Jiangsu, 50 miles (80Km) west of Shanghai. The new factory is 172K sq. ft. (16K sq. m.) and is on 645K sq. ft. (60K sq. m.) of land in the Suzhou Industrial Park. The construction was completed in January 2004, the staff has been through extensive training in Carsem's existing Malaysian factories and the assembly and test equipment to support the manufacture of the MLP (Micro Leadframe Package) Quad and Dual was installed during the second quarter of 2004. Customer qualifications were completed during the second quarter and the factory started shipping production volumes during the third quarter of 2004.

Product & Services

Product Groups Assembled at M Site: MLP MICRO I.C. PDIP (300/600 Mil), PLCC, SOIC (150Mil), MSOP (3.0mm), QSOP (150Mil) MICRO SOT 23, SOT66x, TSOT, SOT, TO92; SC 70 POWER TO220, DDPAK, SOT223 S Site

S Site commenced operations in April,1992. The factory has a total floor space of 384,000 sq. ft. (35,700 M2), a work force of 4,300 employees and the ability to expand by 270,000 sq. ft. (25,000 M2) in the future. Product Groups Assembled at S Site: MLP QUAD, DUAL ARRAY SSBGA, SSLGA, FTBGA, CBGA I.C. PDIP (300 Mil), PLCC, SOIC (150/300 Mil), QSOP (300 Mil), SSOP (5.3mm), TSSOP (4.4/ 6.1mm) QFP MQFP, LQFP, TQFP SiP System in Package

Other Information

VISION

"To be a World Class Company Offering Assembly, Test/Finishing Solutions to Semiconductor Companies Throughout the World"

MISSION

"Carsem will Continue to show Profitable Growth with Emphasis on Employee Development and Operational and Service Indices to Ensure that we are the Employer Of Choice and Supplier Of Choice"

QUALITY

Carsem's policy is to provide products and services of the highest quality through "ZERO DEFECTS TODAY!", preventive Quality culture. Employees will act with honesty, sincerity and operate as a team to continuously strive for improvements in quality, productivity, delivery, services and cost in order to be competitive and profitable. ZERO DEFECTS QUALITY is the responsibility of every employee.

PERSONAL DATA PROTECTION

The Hong Leong Group use personal data in accordance with the Hong Leong Group Privacy Notice for new applicants which can be found (http://www.hongleong.com.my).

Perks and benefits

• Medical Education support
• Dental
• Parking
• Medical for immediate family members
• car subsidy