PMO / NPI Engineer (Semiconductor Manufacturing)
Carsem (M) Sdn. Bhd
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Benefits offered by this job
Job summary
Carsem (M) Sdn. Bhd is seeking a PMO / NPI Engineer to support new product introduction, process release, and production ramp-up in a semiconductor environment.
You will monitor EOL processes, analyze data for yield improvements, and collaborate across functions to ensure product transfers and changes are implemented with quality at the forefront.
Qualifications
- Bachelor's degree in Engineering (Electrical/Electronics/Mechatronics/Manufacturing/Mechanical or related).
- Experience in semiconductor manufacturing, assembly, test, or NPI is a plus.
- Familiarity with process control, yield improvement, and quality systems.
- Knowledge of SPC, FMEA, DOE, and data analysis tools preferred.
- Good analytical, troubleshooting, and communication skills.
Responsibilities
- Support NPI activities for product qualification and ramp-up.
- Monitor EOL processes to meet targets for yield, quality, productivity, and cycle time.
- Provide technical support for process, equipment, and product issues.
- Analyze data to identify trends and drive yield improvements.
- Collaborate with Product/Process/Quality and Equipment Engineering for transfers and changes.
- Maintain process documentation and control plans.
Skills
Education
Tools
Job description
Support New Product Introduction (NPI) activities to ensure successful product qualification, process release, and production ramp-up.
Monitor and sustain End-of-Line (EOL) manufacturing processes to achieve established targets for yield, quality, productivity, and cycle time.
Provide technical support and troubleshooting for process, equipment, and product-related issues, ensuring timely resolution and minimal production impact.
Analyze process and quality data to identify trends, drive yield improvement initiatives, and implement corrective and preventive actions.
Collaborate with cross-functional teams, including Product Engineering, Process Engineering, Manufacturing, Quality, and Equipment Engineering, to support product transfers and engineering changes.
Ensure manufacturing processes comply with customer specifications, technical requirements, and internal quality standards.
Prepare, review, and maintain process documentation, including work instructions, specifications, process flows, and control plans.
Support process characterization, validation, and qualification activities for new products, materials, and equipment.
Assist in establishing standard process parameters, UPH (Units Per Hour), and material consumption requirements for new products and processes.
Participate in continuous improvement initiatives to enhance process capability, reduce defects, improve productivity, and optimize manufacturing costs.
Provide technical guidance to technicians and operators to ensure compliance with approved procedures and process controls.
Quality Accountability
Review and disposition non-conforming products in accordance with established procedures and quality requirements.
Ensure compliance with Manufacturing Operating Procedures (MOP), process specifications, and control requirements.
Support risk assessment activities related to process and quality issues.
Monitor process performance and implement corrective actions for identified gaps.
Establish and maintain process documentation and MOPs for new products and processes.
Raise quality incidents and support investigation, containment, and corrective action activities.
Participate in root cause analysis using structured problem-solving methodologies (e.g., 8D, 5 Why, Fishbone).
Communicate quality alerts, process changes, and engineering updates to relevant stakeholders in a timely manner.
Maintain data accuracy and integrity in all engineering, production, and quality records.
Requirements
Bachelor's Degree in Engineering (Electrical, Electronics, Mechatronics, Manufacturing, Mechanical, or related discipline).
Experience in semiconductor manufacturing, assembly, test, or NPI environment is an added advantage.
Knowledge of process control, yield improvement, quality systems, and problem-solving methodologies.
Familiarity with SPC, FMEA, DOE, and statistical data analysis tools is preferred.
Good analytical, troubleshooting, and communication skills.
Able to work effectively in a cross-functional and fast-paced manufacturing environment.
Proficient in Microsoft Office applications, particularly Excel and PowerPoint.
Consumer Electronics Manufacturing More than 10,000 employees
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest range package & test portfolios in the world.
Founded in 1972, Carsem is among the most experienced companies in our industry and is recognized as one of the largest in unit volume production. We have over 6,000 employees and ship in excess of 100 million units each week and more than 65% of this volume is shipped as fully tested product. Carsem is a member of one of South East Asia's most successful corporations, the Hong Leong Group, who views semiconductors as a core business.
We have three high technology factories. Two are located in Ipoh, Malaysia, and a new third factory is located in Suzhou, China. The two factories in Malaysia, Carsem - M Site and Carsem - S Site, are 10 miles (16Km) apart. Ipoh is a 90 minute drive from Penang and 2.5 hours from Kuala Lumpur.
The factories are supported by extensive R&D and failure analysis staff and incorporate highly sophisticated, "state of the art" automated equipment, ensuring quality products which meet the exacting standards of all the automotive, telecom, computer and consumer goods industries. Both factories maintain world-class quality standards having achieved ISO/TS 16949, ISO-9001, ISO-14001 certifications and comply to the Sony Green Partner Program. They are supported with a global network of sales and technical support offices. The China factory, Carsem-Suzhou Ltd., is located in the province of Jiangsu, 50 miles (80Km) west of Shanghai. The new factory is 172K sq. ft. (16K sq. m.) and is on 645K sq. ft. (60K sq. m.) of land in the Suzhou Industrial Park. The construction was completed in January 2004, the staff has been through extensive training in Carsem's existing Malaysian factories and the assembly and test equipment to support the manufacture of the MLP (Micro Leadframe Package) Quad and Dual was installed during the second quarter of 2004. Customer qualifications were completed during the second quarter and the factory started shipping production volumes during the third quarter of 2004.
Product & Services
Product Groups Assembled at M Site: MLP MICRO I.C. PDIP (300/600 Mil), PLCC, SOIC (150Mil), MSOP (3.0mm), QSOP (150Mil) MICRO SOT 23, SOT66x, TSOT, SOT, TO92; SC 70 POWER TO220, DDPAK, SOT223 S Site
S Site commenced operations in April,1992. The factory has a total floor space of 384,000 sq. ft. (35,700 M2), a work force of 4,300 employees and the ability to expand by 270,000 sq. ft. (25,000 M2) in the future. Product Groups Assembled at S Site: MLP QUAD, DUAL ARRAY SSBGA, SSLGA, FTBGA, CBGA I.C. PDIP (300 Mil), PLCC, SOIC (150/300 Mil), QSOP (300 Mil), SSOP (5.3mm), TSSOP (4.4/ 6.1mm) QFP MQFP, LQFP, TQFP SiP System in Package
Other Information
VISION
"To be a World Class Company Offering Assembly, Test/Finishing Solutions to Semiconductor Companies Throughout the World"
MISSION
"Carsem will Continue to show Profitable Growth with Emphasis on Employee Development and Operational and Service Indices to Ensure that we are the Employer Of Choice and Supplier Of Choice"
QUALITY
Carsem's policy is to provide products and services of the highest quality through "ZERO DEFECTS TODAY!", preventive Quality culture. Employees will act with honesty, sincerity and operate as a team to continuously strive for improvements in quality, productivity, delivery, services and cost in order to be competitive and profitable. ZERO DEFECTS QUALITY is the responsibility of every employee.
PERSONAL DATA PROTECTION
The Hong Leong Group use personal data in accordance with the Hong Leong Group Privacy Notice for new applicants which can be found (http://www.hongleong.com.my).
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest range package & test portfolios in the world.
Founded in 1972, Carsem is among the most experienced companies in our industry and is recognized as one of the largest in unit volume production. We have over 6,000 employees and ship in excess of 100 million units each week and more than 65% of this volume is shipped as fully tested product. Carsem is a member of one of South East Asia's most successful corporations, the Hong Leong Group, who views semiconductors as a core business.
We have three high technology factories. Two are located in Ipoh, Malaysia, and a new third factory is located in Suzhou, China. The two factories in Malaysia, Carsem - M Site and Carsem - S Site, are 10 miles (16Km) apart. Ipoh is a 90 minute drive from Penang and 2.5 hours from Kuala Lumpur.
The factories are supported by extensive R&D and failure analysis staff and incorporate highly sophisticated, "state of the art" automated equipment, ensuring quality products which meet the exacting standards of all the automotive, telecom, computer and consumer goods industries. Both factories maintain world-class quality standards having achieved ISO/TS 16949, ISO-9001, ISO-14001 certifications and comply to the Sony Green Partner Program. They are supported with a global network of sales and technical support offices. The China factory, Carsem-Suzhou Ltd., is located in the province of Jiangsu, 50 miles (80Km) west of Shanghai. The new factory is 172K sq. ft. (16K sq. m.) and is on 645K sq. ft. (60K sq. m.) of land in the Suzhou Industrial Park. The construction was completed in January 2004, the staff has been through extensive training in Carsem's existing Malaysian factories and the assembly and test equipment to support the manufacture of the MLP (Micro Leadframe Package) Quad and Dual was installed during the second quarter of 2004. Customer qualifications were completed during the second quarter and the factory started shipping production volumes during the third quarter of 2004.
Product & Services
Product Groups Assembled at M Site: MLP MICRO I.C. PDIP (300/600 Mil), PLCC, SOIC (150Mil), MSOP (3.0mm), QSOP (150Mil) MICRO SOT 23, SOT66x, TSOT, SOT, TO92; SC 70 POWER TO220, DDPAK, SOT223 S Site
S Site commenced operations in April,1992. The factory has a total floor space of 384,000 sq. ft. (35,700 M2), a work force of 4,300 employees and the ability to expand by 270,000 sq. ft. (25,000 M2) in the future. Product Groups Assembled at S Site: MLP QUAD, DUAL ARRAY SSBGA, SSLGA, FTBGA, CBGA I.C. PDIP (300 Mil), PLCC, SOIC (150/300 Mil), QSOP (300 Mil), SSOP (5.3mm), TSSOP (4.4/ 6.1mm) QFP MQFP, LQFP, TQFP SiP System in Package
Other Information
VISION
"To be a World Class Company Offering Assembly, Test/Finishing Solutions to Semiconductor Companies Throughout the World"
MISSION
"Carsem will Continue to show Profitable Growth with Emphasis on Employee Development and Operational and Service Indices to Ensure that we are the Employer Of Choice and Supplier Of Choice"
QUALITY
Carsem's policy is to provide products and services of the highest quality through "ZERO DEFECTS TODAY!", preventive Quality culture. Employees will act with honesty, sincerity and operate as a team to continuously strive for improvements in quality, productivity, delivery, services and cost in order to be competitive and profitable. ZERO DEFECTS QUALITY is the responsibility of every employee.
PERSONAL DATA PROTECTION
The Hong Leong Group use personal data in accordance with the Hong Leong Group Privacy Notice for new applicants which can be found (http://www.hongleong.com.my).
Perks and benefits Medical Education support Dental Parking Medical for immediate family members, car subsidy
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