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Carsem (M) Sdn. Bhd, Ipoh, Malaysia, seeks an IT Factory Integration Senior Section Manager to lead the factory's digital backbone. You will steer real-time data architectures, microservices, and industrial automation integration on the shop floor.
You will manage a team, partner with IT and engineering, and drive architecture for scalable, secure, and highly available systems across CIM and automation domains.
We are seeking a visionary and technically profound IT Factory Integration Senior Section Manager to spearhead our smart manufacturing and industrial automation systems. In this critical leadership role, you will lead a high-performing engineering section responsible for building the digital backbone of our factory floor. You will bridge the gap between enterprise IT, software development, and industrial automation, driving the strategy for real-time data architectures and seamless system integration.
Strategic Leadership & Governance: Lead and manage the Factory Integration section, establishing technical roadmaps, resource allocation strategies, and best practices for software development and systems integration.
Stakeholder & Requirement Management: Work directly with senior users, department heads, and external customers to gather complex manufacturing requirements and define high-level system specifications.
Architecture & Microservices Oversight: Drive the architectural design and implementation of scalable microservices architectures using Docker, Kubernetes, RESTful APIs, and gRPC for robust factory floor applications.
Real-Time Data Infrastructure: Direct the deployment and optimization of enterprise message streaming architectures (Kafka, Confluent, RabbitMQ, MQTT) to support real-time data processing and analytics.
Industrial Automation Integration: Oversee the implementation of SECS/GEM communication protocols, ensuring flawless compatibility between enterprise software, embedded systems, and industrial automation hardware.
Cross-Functional IT Collaboration: Partner with infrastructure, cybersecurity, and broader IT teams to ensure seamless system integration, secure resource access, and high system availability.
Engineering Excellence: Ensure the creation and upkeep of rigorous technical documentation frameworks for rapid troubleshooting. Champion continuous improvement in system performance and optimization loops.
Experience: 5 to 10 years of relevant experience in IT factory integration, CIM (Computer Integrated Manufacturing), or industrial automation environments, with at least 3+ years in a supervisory or engineering management capacity.
Education: Bachelor’s or Master’s Degree in Computer Science, Software Engineering, Electrical/Electronic Engineering, or a related field.
Technical Architecture Expertise:
Deep understanding of microservices architectures (Docker, Kubernetes) and modern API patterns (RESTful, gRPC).
Strong architectural grasp of message brokers and event-driven streaming platforms (Kafka, Confluent, RabbitMQ, or MQTT).
Hands-on history or strong architectural familiarity with industrial equipment communication standard protocols, specifically SECS/GEM.
Domain Knowledge: Solid understanding of software-to-hardware interfaces, embedded systems, and shop-floor automation integration.
Leadership & Soft Skills: Proven track record of managing engineering teams, executing complex projects on time, and managing stakeholder expectations across both technical and business divisions.
Consumer Electronics Manufacturing More than 10,000 employees
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest range package & test portfolios in the world.
Founded in 1972, Carsem is among the most experienced companies in our industry and is recognized as one of the largest in unit volume production. We have over 6,000 employees and ship in excess of 100 million units each week and more than 65% of this volume is shipped as fully tested product. Carsem is a member of one of South East Asia's most successful corporations, the Hong Leong Group, who views semiconductors as a core business.
We have three high technology factories. Two are located in Ipoh, Malaysia, and a new third factory is located in Suzhou, China. The two factories in Malaysia, Carsem - M Site and Carsem - S Site, are 10 miles (16Km) apart. Ipoh is a 90 minute drive from Penang and 2.5 hours from Kuala Lumpur.
The factories are supported by extensive R&D and failure analysis staff and incorporate highly sophisticated, "state of the art" automated equipment, ensuring quality products which meet the exacting standards of all the automotive, telecom, computer and consumer goods industries. Both factories maintain world-class quality standards having achieved ISO/TS 16949, ISO-9001, ISO-14001 certifications and comply to the Sony Green Partner Program. They are supported with a global network of sales and technical support offices. The China factory, Carsem-Suzhou Ltd., is located in the province of Jiangsu, 50 miles (80Km) west of Shanghai. The new factory is 172K sq. ft. (16K sq. m.) and is on 645K sq. ft. (60K sq. m.) of land in the Suzhou Industrial Park. The construction was completed in January 2004, the staff has been through extensive training in Carsem's existing Malaysian factories and the assembly and test equipment to support the manufacture of the MLP (Micro Leadframe Package) Quad and Dual was installed during the second quarter of 2004. Customer qualifications were completed during the second quarter and the factory started shipping production volumes during the third quarter of 2004.
Product & Services
Product Groups Assembled at M Site: MLP MICRO I.C. PDIP (300/600 Mil), PLCC, SOIC (150Mil), MSOP (3.0mm), QSOP (150Mil) MICRO SOT 23, SOT66x, TSOT, SOT, TO92; SC 70 POWER TO220, DDPAK, SOT223 S Site
S Site commenced operations in April,1992. The factory has a total floor space of 384,000 sq. ft. (35,700 M2), a work force of 4,300 employees and the ability to expand by 270,000 sq. ft. (25,000 M2) in the future. Product Groups Assembled at S Site: MLP QUAD, DUAL ARRAY SSBGA, SSLGA, FTBGA, CBGA I.C. PDIP (300 Mil), PLCC, SOIC (150/300 Mil), QSOP (300 Mil), SSOP (5.3mm), TSSOP (4.4/ 6.1mm) QFP MQFP, LQFP, TQFP SiP System in Package
Other Information
VISION
"To be a World Class Company Offering Assembly, Test/Finishing Solutions to Semiconductor Companies Throughout the World"
MISSION
"Carsem will Continue to show Profitable Growth with Emphasis on Employee Development and Operational and Service Indices to Ensure that we are the Employer Of Choice and Supplier Of Choice"
QUALITY
Carsem's policy is to provide products and services of the highest quality through "ZERO DEFECTS TODAY!", preventive Quality culture. Employees will act with honesty, sincerity and operate as a team to continuously strive for improvements in quality, productivity, delivery, services and cost in order to be competitive and profitable. ZERO DEFECTS QUALITY is the responsibility of every employee.
PERSONAL DATA PROTECTION
The Hong Leong Group use personal data in accordance with the Hong Leong Group Privacy Notice for new applicants which can be found (http://www.hongleong.com.my).
Perks and benefits Medical Education support Dental Parking Medical for immediate family members, car subsidy