FOL Development Staff Engineer
Carsem (M) Sdn. Bhd
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Benefits offered by this job
Job summary
Carsem (M) Sdn. Bhd is seeking a senior packaging engineer to lead the design and development of high-power discrete and power module packages in Ipoh, Malaysia.
You will translate customer requirements into specifications and collaborate across design, materials, and process teams to optimize package structures and assembly flows. You will apply DFM principles to ensure robust production, cost control, and quality compliance, while overseeing electrical, thermal and reliability characterization
Qualifications
- Bachelor’s or Master’s Degree in Mechanical, Electrical, Materials Engineering or related field.
- At least 5 years of experience in high-power discrete or power module packaging development.
- Proven track record leading NPI projects from concept through HVM transfer.
- In-depth knowledge of FOL processes including SiC wafer dicing, solder reflow and gel-fill modules, and reliability standards.
Responsibilities
- Lead end-to-end design and development of high-power discrete and power module packaging.
- Translate customer requirements into PRS and SCD.
- Collaborate with design, materials, and process teams to optimize structures and flows.
- Apply DFM to ensure robust production, cost control and quality.
- Oversee electrical, thermal and reliability characterization and qualification.
- Develop and maintain DFMEA, PFMEA, QFD, LAR, control plans and procurement specs.
- Drive NPI project timelines, deliverables and risk mitigation.
- Mentor junior engineers and drive continuous improvement; support audits.
Skills
Education
Tools
Job description
Lead the end-to-end design and development of high-power discrete and power module packages.
Translate customer requirements into Package Requirement Specifications (PRS) and Supplier Component Documents (SCD).
Collaborate with design, materials, and process teams to define optimized package structures and assembly flows.
Apply Design for Manufacturability (DFM) principles to ensure robust production, cost control, and quality compliance.
Develop and maintain technical documentation including DFMEA, PFMEA, QFD, LAR plans, control plans, and procurement specifications.
Oversee electrical, thermal, and reliability characterization and qualification activities.
Contribute to the development and maintenance of the Wide Bandgap (WBG) packaging technology roadmap.
New Product Introduction (NPI) Project Management
Manage complete NPI project timelines, deliverables, and risk mitigation activities.
Lead prototyping, proof-of-concept builds, qualification runs, and transition to high-volume manufacturing (HVM).
Conduct technical design reviews and lead phase gate execution.
Collaborate with Business Units (BU), QA, manufacturing, and application teams to ensure aligned project execution.
Use structured problem-solving methods such as 8D and RCCA for resolving design and process challenges.
Ensure compliance with internal NPI frameworks and customer-specific milestones.
Leadership & Technical Influence
Mentor junior engineers and foster a strong, innovation-driven technical culture.
Contribute to continuous improvement initiatives and share best practices across cross-functional teams.
Support customer audits and lead technical discussions during product qualification phases.
Bachelor’s or Master’s Degree in Mechanical, Electrical, Materials Engineering, or a related field.
At least 5 years of experience in high-power discrete or power module packaging development.
Proven track record in leading NPI projects from concept through HVM transfer.
In-depth knowledge of FOL (Front-of-Line) processes, including:
SiC wafer dicing
Solder reflow and gel-fill modules
Thermal and electrical design optimization
Familiarity with JEDEC, AEC-Q100, and relevant reliability standards.
Technical Expertise
Power package design and device-package interaction
Material selection and reliability testing
Alignment with Wide Bandgap (WBG) packaging roadmaps
Analytical Tools & Software
AutoCAD, JMP, Minitab
Microsoft Excel, PowerPoint, and technical report writing
Strong skills in NPI planning, risk-based thinking, and milestone tracking
Clear communication across departments and with customers
Ability to influence and lead in cross-functional technical discussions
Problem Solving & Innovation
Proficient in 8D, RCCA for root cause analysis
Consumer Electronics Manufacturing More than 10,000 employees
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest range package & test portfolios in the world.
Founded in 1972, Carsem is among the most experienced companies in our industry and is recognized as one of the largest in unit volume production. We have over 6,000 employees and ship in excess of 100 million units each week and more than 65% of this volume is shipped as fully tested product. Carsem is a member of one of South East Asia's most successful corporations, the Hong Leong Group, who views semiconductors as a core business.
We have three high technology factories. Two are located in Ipoh, Malaysia, and a new third factory is located in Suzhou, China. The two factories in Malaysia, Carsem - M Site and Carsem - S Site, are 10 miles (16Km) apart. Ipoh is a 90 minute drive from Penang and 2.5 hours from Kuala Lumpur.
The factories are supported by extensive R&D and failure analysis staff and incorporate highly sophisticated, "state of the art" automated equipment, ensuring quality products which meet the exacting standards of all the automotive, telecom, computer and consumer goods industries. Both factories maintain world-class quality standards having achieved ISO/TS 16949, ISO-9001, ISO-14001 certifications and comply to the Sony Green Partner Program. They are supported with a global network of sales and technical support offices. The China factory, Carsem-Suzhou Ltd., is located in the province of Jiangsu, 50 miles (80Km) west of Shanghai. The new factory is 172K sq. ft. (16K sq. m.) and is on 645K sq. ft. (60K sq. m.) of land in the Suzhou Industrial Park. The construction was completed in January 2004, the staff has been through extensive training in Carsem's existing Malaysian factories and the assembly and test equipment to support the manufacture of the MLP (Micro Leadframe Package) Quad and Dual was installed during the second quarter of 2004. Customer qualifications were completed during the second quarter and the factory started shipping production volumes during the third quarter of 2004.
Product & Services
Product Groups Assembled at M Site: MLP MICRO I.C. PDIP (300/600 Mil), PLCC, SOIC (150Mil), MSOP (3.0mm), QSOP (150Mil) MICRO SOT 23, SOT66x, TSOT, SOT, TO92; SC 70 POWER TO220, DDPAK, SOT223 S Site
S Site commenced operations in April,1992. The factory has a total floor space of 384,000 sq. ft. (35,700 M2), a work force of 4,300 employees and the ability to expand by 270,000 sq. ft. (25,000 M2) in the future. Product Groups Assembled at S Site: MLP QUAD, DUAL ARRAY SSBGA, SSLGA, FTBGA, CBGA I.C. PDIP (300 Mil), PLCC, SOIC (150/300 Mil), QSOP (300 Mil), SSOP (5.3mm), TSSOP (4.4/ 6.1mm) QFP MQFP, LQFP, TQFP SiP System in Package
Other Information
VISION
"To be a World Class Company Offering Assembly, Test/Finishing Solutions to Semiconductor Companies Throughout the World"
MISSION
"Carsem will Continue to show Profitable Growth with Emphasis on Employee Development and Operational and Service Indices to Ensure that we are the Employer Of Choice and Supplier Of Choice"
QUALITY
Carsem's policy is to provide products and services of the highest quality through "ZERO DEFECTS TODAY!", preventive Quality culture. Employees will act with honesty, sincerity and operate as a team to continuously strive for improvements in quality, productivity, delivery, services and cost in order to be competitive and profitable. ZERO DEFECTS QUALITY is the responsibility of every employee.
PERSONAL DATA PROTECTION
The Hong Leong Group use personal data in accordance with the Hong Leong Group Privacy Notice for new applicants which can be found (http://www.hongleong.com.my).
Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest range package & test portfolios in the world.
Founded in 1972, Carsem is among the most experienced companies in our industry and is recognized as one of the largest in unit volume production. We have over 6,000 employees and ship in excess of 100 million units each week and more than 65% of this volume is shipped as fully tested product. Carsem is a member of one of South East Asia's most successful corporations, the Hong Leong Group, who views semiconductors as a core business.
We have three high technology factories. Two are located in Ipoh, Malaysia, and a new third factory is located in Suzhou, China. The two factories in Malaysia, Carsem - M Site and Carsem - S Site, are 10 miles (16Km) apart. Ipoh is a 90 minute drive from Penang and 2.5 hours from Kuala Lumpur.
The factories are supported by extensive R&D and failure analysis staff and incorporate highly sophisticated, "state of the art" automated equipment, ensuring quality products which meet the exacting standards of all the automotive, telecom, computer and consumer goods industries. Both factories maintain world-class quality standards having achieved ISO/TS 16949, ISO-9001, ISO-14001 certifications and comply to the Sony Green Partner Program. They are supported with a global network of sales and technical support offices. The China factory, Carsem-Suzhou Ltd., is located in the province of Jiangsu, 50 miles (80Km) west of Shanghai. The new factory is 172K sq. ft. (16K sq. m.) and is on 645K sq. ft. (60K sq. m.) of land in the Suzhou Industrial Park. The construction was completed in January 2004, the staff has been through extensive training in Carsem's existing Malaysian factories and the assembly and test equipment to support the manufacture of the MLP (Micro Leadframe Package) Quad and Dual was installed during the second quarter of 2004. Customer qualifications were completed during the second quarter and the factory started shipping production volumes during the third quarter of 2004.
Product & Services
Product Groups Assembled at M Site: MLP MICRO I.C. PDIP (300/600 Mil), PLCC, SOIC (150Mil), MSOP (3.0mm), QSOP (150Mil) MICRO SOT 23, SOT66x, TSOT, SOT, TO92; SC 70 POWER TO220, DDPAK, SOT223 S Site
S Site commenced operations in April,1992. The factory has a total floor space of 384,000 sq. ft. (35,700 M2), a work force of 4,300 employees and the ability to expand by 270,000 sq. ft. (25,000 M2) in the future. Product Groups Assembled at S Site: MLP QUAD, DUAL ARRAY SSBGA, SSLGA, FTBGA, CBGA I.C. PDIP (300 Mil), PLCC, SOIC (150/300 Mil), QSOP (300 Mil), SSOP (5.3mm), TSSOP (4.4/ 6.1mm) QFP MQFP, LQFP, TQFP SiP System in Package
Other Information
VISION
"To be a World Class Company Offering Assembly, Test/Finishing Solutions to Semiconductor Companies Throughout the World"
MISSION
"Carsem will Continue to show Profitable Growth with Emphasis on Employee Development and Operational and Service Indices to Ensure that we are the Employer Of Choice and Supplier Of Choice"
QUALITY
Carsem's policy is to provide products and services of the highest quality through "ZERO DEFECTS TODAY!", preventive Quality culture. Employees will act with honesty, sincerity and operate as a team to continuously strive for improvements in quality, productivity, delivery, services and cost in order to be competitive and profitable. ZERO DEFECTS QUALITY is the responsibility of every employee.
PERSONAL DATA PROTECTION
The Hong Leong Group use personal data in accordance with the Hong Leong Group Privacy Notice for new applicants which can be found (http://www.hongleong.com.my).
Perks and benefits Medical Education support Dental Parking Medical for immediate family members, car subsidy
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