Senior Tooling Engineer (Injection Molding)

Carsem (M) Sdn. Bhd

Ipoh

On-site

MYR 60,000 - 90,000

Full time

14 days+

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Benefits offered by this job

Medical

Education support

Dental

Parking

Medical for immediate family members

Car subsidy

Job summary

Carsem (M) Sdn. Bhd is seeking an experienced Mold Tooling Engineer to coordinate preventive maintenance and drive improvements in tooling reliability. You will review reports, drawings, and measurements while supporting refurbishment, trials, and inspections.

You will lead CAPA actions and collaborate with production and engineering to resolve tooling issues. The role requires a Bachelor’s degree in Mechanical/Electrical/Mechatronic Engineering and 5+ years in tooling or molding environments,

Qualifications

Bachelor's degree in mechanical, Electrical/Electronic, Mechatronic Engineering, or a related discipline.
Minimum 5 years of experience in tooling, mold maintenance, injection molding, or manufacturing engineering.
Strong knowledge of mold tooling maintenance, troubleshooting, and preventive maintenance practices.
Ability to interpret technical drawings, machine manuals, and engineering documentation.
Experience in failure analysis, root cause investigation, and CAPA implementation.
Proficient in 3D CAD software such as SolidWorks, Creo, AutoCAD, NX, or equivalent.
Good communication, teamwork, and problem-solving skills.
Experience in semiconductor manufacturing will be an added advantage.
Self-motivated and able to thrive in a fast-paced manufacturing environment.

Responsibilities

Coordinate and oversee mold tooling preventive maintenance (PM) activities.
Support mold refurbishment, mold part replacement, sample trials, and inspections.
Monitor tool life performance of critical mold components and drive improvements.
Investigate mold tooling issues and implement CAPA.
Prepare and maintain 3D models, drawings, and tooling documentation.
Lead tooling-related improvement projects and support equipment enhancements.
Collaborate with production, maintenance, and engineering to resolve tooling issues.

Skills

Mold tooling maintenance

Engineering drawings

CAPA implementation

3D CAD software

Communication & teamwork

Semiconductor experience

Education

Bachelor's degree in Mechanical / Electrical / Mechatronic Engineering

Tools

SolidWorks

Creo

AutoCAD

Job description

Coordinate and oversee mold tooling preventive maintenance (PM) activities, including review of maintenance reports, measurement data, and PM completion records.

Support mold refurbishment, mold part replacement, sample trials, and visual and dimensional inspections.

Monitor tool life performance of critical mold components and drive improvement actions to enhance tooling reliability.

Investigate mold tooling issues, perform root cause analysis, and implement corrective and preventive actions (CAPA).

Prepare and maintain 3D models, engineering drawings, and tooling documentation using CAD software.

Lead tooling-related improvement projects and support mold equipment enhancement initiatives.

Work closely with production, maintenance, and engineering teams to resolve tooling and equipment-related issues efficiently.

Requirements

Bachelor's degree in mechanical, Electrical/Electronic, Mechatronic Engineering, or a related discipline.

Minimum 5 years of experience in tooling, mold maintenance, injection molding, or manufacturing engineering.

Strong knowledge of mold tooling maintenance, troubleshooting, and preventive maintenance practices.

Ability to interpret technical drawings, machine manuals, and engineering documentation.

Experience in failure analysis, root cause investigation, and CAPA implementation.

Proficient in 3D CAD software such as SolidWorks, Creo, AutoCAD, NX, or equivalent.

Good communication, teamwork, and problem-solving skills.

Experience in semiconductor manufacturing will be an added advantage.

Self-motivated and able to thrive in a fast-paced manufacturing environment.

Consumer Electronics Manufacturing More than 10,000 employees

Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest range package & test portfolios in the world.

Founded in 1972, Carsem is among the most experienced companies in our industry and is recognized as one of the largest in unit volume production. We have over 6,000 employees and ship in excess of 100 million units each week and more than 65% of this volume is shipped as fully tested product. Carsem is a member of one of South East Asia's most successful corporations, the Hong Leong Group, who views semiconductors as a core business.

We have three high technology factories. Two are located in Ipoh, Malaysia, and a new third factory is located in Suzhou, China. The two factories in Malaysia, Carsem - M Site and Carsem - S Site, are 10 miles (16Km) apart. Ipoh is a 90 minute drive from Penang and 2.5 hours from Kuala Lumpur.

The factories are supported by extensive R&D and failure analysis staff and incorporate highly sophisticated, "state of the art" automated equipment, ensuring quality products which meet the exacting standards of all the automotive, telecom, computer and consumer goods industries. Both factories maintain world-class quality standards having achieved ISO/TS 16949, ISO-9001, ISO-14001 certifications and comply to the Sony Green Partner Program. They are supported with a global network of sales and technical support offices. The China factory, Carsem-Suzhou Ltd., is located in the province of Jiangsu, 50 miles (80Km) west of Shanghai. The new factory is 172K sq. ft. (16K sq. m.) and is on 645K sq. ft. (60K sq. m.) of land in the Suzhou Industrial Park. The construction was completed in January 2004, the staff has been through extensive training in Carsem's existing Malaysian factories and the assembly and test equipment to support the manufacture of the MLP (Micro Leadframe Package) Quad and Dual was installed during the second quarter of 2004. Customer qualifications were completed during the second quarter and the factory started shipping production volumes during the third quarter of 2004.

Product & Services

Product Groups Assembled at M Site: MLP MICRO I.C. PDIP (300/600 Mil), PLCC, SOIC (150Mil), MSOP (3.0mm), QSOP (150Mil) MICRO SOT 23, SOT66x, TSOT, SOT, TO92; SC 70 POWER TO220, DDPAK, SOT223 S Site

S Site commenced operations in April,1992. The factory has a total floor space of 384,000 sq. ft. (35,700 M2), a work force of 4,300 employees and the ability to expand by 270,000 sq. ft. (25,000 M2) in the future. Product Groups Assembled at S Site: MLP QUAD, DUAL ARRAY SSBGA, SSLGA, FTBGA, CBGA I.C. PDIP (300 Mil), PLCC, SOIC (150/300 Mil), QSOP (300 Mil), SSOP (5.3mm), TSSOP (4.4/ 6.1mm) QFP MQFP, LQFP, TQFP SiP System in Package

Other Information

VISION

"To be a World Class Company Offering Assembly, Test/Finishing Solutions to Semiconductor Companies Throughout the World"

MISSION

"Carsem will Continue to show Profitable Growth with Emphasis on Employee Development and Operational and Service Indices to Ensure that we are the Employer Of Choice and Supplier Of Choice"

QUALITY

Carsem's policy is to provide products and services of the highest quality through "ZERO DEFECTS TODAY!", preventive Quality culture. Employees will act with honesty, sincerity and operate as a team to continuously strive for improvements in quality, productivity, delivery, services and cost in order to be competitive and profitable. ZERO DEFECTS QUALITY is the responsibility of every employee.

PERSONAL DATA PROTECTION

The Hong Leong Group use personal data in accordance with the Hong Leong Group Privacy Notice for new applicants which can be found (http://www.hongleong.com.my).

Perks and benefits Medical Education support Dental Parking Medical for immediate family members, car subsidy