Senior Staff Engineer Package Technology

Infineon Technologies; Malacca City; On-site; MYR 120,000 - 190,000; Full time

Job summary

Infineon Technologies Malaysia in Malacca City is seeking a Senior Staff Engineer to lead advanced package technology in our Research & Development team. You will define packaging concepts, coordinate cross-functional activities, and shape the future of power and microelectronics packaging.

The role requires a bachelor's in engineering and at least seven years in IC/semiconductor packaging, plus strong analytical skills and proficiency with CAD tools.

Qualifications

• Bachelor's degree in engineering required.
• Minimum 7 years in IC or semiconductor industry.
• Strong knowledge of packaging, assembly and test processes.
• Knowledge of failure analysis and reliability engineering.
• Strong analytical and problem-solving skills.
• Proficiency in AutoCAD and 3D drafting preferred.

Responsibilities

• Drive technical definition activities for package projects with major changes or business impact.
• Develop conceptual package outlines and internal construction drawings; update drawings as required.
• Define package characteristics to meet electrical, thermal, mechanical and reliability needs.
• Coordinate package cost estimation activities (A1-A3) and cost indication (A3).
• Serve as liaison and technical consultant to Business Divisions on backend assembly tech.
• Support pre-development and project definition phases; act as package design expert.
• Scout emerging packaging technologies and monitor competitors and subcontractors.
• Consolidate inputs for ADR and ensure timely updates for A-projects.
• Act as primary contact, technical consultant, and coach for packaging topics.

Skills

Analytical thinking

Problem solving

CAD proficiency

Semiconductor packaging knowledge

Education

Bachelor's Degree in Engineering

Tools

AutoCAD

3D drafting

Job description

#WeAreIn for jobs that impact everyone's life.

What if your ideas could change the way the world connects, powers up, or thinks?

As a Senior Staff Engineer Package Technology in our Research & Development team, you'll have the opportunity to merge creativity with your technical expertise by shaping the future of technology, driving groundbreaking projects, and bringing new ideas to life.

Are you in?

Your role

Key responsibilities in your new role

• Drive technical definition activities for package projects involving major changes, new package developments, significant risks, or business impacts, including BOM, package design, assembly technology, PRP reviews, and project classification.
• Develop conceptual package outlines and internal construction drawings, finalize and document package designs, and maintain drawing updates as required.
• Define package characteristics to meet electrical, thermal, mechanical, and reliability requirements.
• Coordinate package cost estimation activities (A1-A3) and cost indication processes (A3).
• Serve as the key liaison and technical consultant to Business Divisions on package definition, particularly regarding backend assembly technology expertise.
• Support pre-development and project definition phases, and act as the package design expert throughout the project lifecycle.
• Proactively scout emerging packaging technologies and maintain awareness of developments within competitors and subcontractors.
• Consolidate inputs for ADR and ensure content accuracy and timely updates for A-projects.
• Act as the primary contact person, technical consultant, and coach for all matters related to packaging, package design, and package development.
• Drive innovation and pre-development activities within the package platform.

Your profile

Qualifications And Skills To Help You Succeed

• Bachelor's Degree in Engineering, preferably in Semiconductor Technology, Microelectronics, Automation, Mechanical Engineering, Electrical Engineering, Electronics Engineering, or Physics.
• Minimum 7 years of relevant working experience in the IC or semiconductor industry.
• Strong knowledge of semiconductor packaging, assembly and test processes, and equipment engineering.
• Knowledge of failure analysis and reliability engineering.
• Strong analytical and problem-solving skills.
• Proficiency in AutoCAD and 3D drafting is preferred.

#WeAreIn for driving decarbonization and digitalization.

As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.

Are you in?

We are on a journey to create the best Infineon for everyone.

We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity.

Our hiring decisions are based on skills and experience. Even if you don’t meet every requirement, we encourage you to apply.

Please let your recruiter know if you need any accommodations during the interview process.

Learn more about our various contact channels and about Diversity & Inclusion at Infineon.