Senior Staff Engineer Process Integration/ Product Engineering

Infineon Technologies AG; Kulim; On-site; MYR 180,000 - 240,000; Full time

Job summary

Infineon Technologies AG in Kulim, Malaysia, invites applications for a senior role spanning process integration and product engineering in advanced semiconductor technology. You will support new technology development, drive yield, cost and quality improvements, and act as interface between front-end and back-end teams.

The ideal candidate holds a PhD/masters/bachelor in relevant fields, has deep semiconductor device physics knowledge, and at least 5 years of experience with a proven track

Qualifications

• Phd, master’s or bachelor’s Degree in the Physics / Device Physics / Semiconductor device / Wafer Fabrication / Material Science / Engineering in Micro Electronic / Electronic / Electrical / Material / Chemical
• Excellent knowledge of semiconductor device physics/wafer fabrication process & passionate in technical on semiconductor devices
• In depth knowledge in all type of analysis and problem-solving methodologies e.g. 8D, SPC, FMEA, Six Sigma & DOE.
• Strong communication skills, able to interact with all levels of personnel
• Able to drive and lead improvement projects.
• Minimum 5 years of working experience in Semiconductor industry preferred
• Candidates with direct fab experience in Process Integration/Yield Enhancement/Product Engineering/Technology Development will have an added advantage

Responsibilities

• Support new technology product development/transfer and drive integration and ramp-up of yield, cost, stability and quality of new technologies and new products
• Initiate/lead yield, inline, PCM, DD, cost and quality improvement programs. Identify product or technology, or process margin related problem. Work with business unit, developer and unit process to improve stability, yield, cost and quality.
• Deviation lot assessment & disposition to ensure quality of products delivered to customers meet quality and reliability standard. Provide expert knowledge on risk assessment on product quality and reliability
• Drive fast feedback to production line in case of deviation, identification of source and fast feedback and subsequently pursue for the prevention. Lead 8D.
• Lead technical topics across functional, cross technologies.
• Support and provide containment and improvement plan for customer issue.
• Lead/tech topics across functions and technologies.
• Perform DOE splits for process margin study and improvement to improve technology/product performance
• Own wafer fab performance indicator e.g. fab yield, PCM, inline and DD stability.
• Own wafer test performance e.g. wafer function test yield
• Act as an interface between Front End and Back End on yield, quality and reliability improvement topics
• Interface with business unit on product spec issue

Skills

Semiconductor physics

Wafer fabrication process

Problem solving (8D, SPC, FMEA, DOE)

Communication skills

Education

PhD / MSc / BSc in Physics/Device Physics/Semiconductor/Materials Engineering

Job description

Your Role

Key responsibilities in your new role:

Responsibilities Process Integration / Product Engineering

• Support new technology product development/transfer. Drive integration and ramp‑up of yield, cost, stability and quality of new technologies and new product
• Initiate/lead yield, Inline, PCM, DD, cost and quality improvement programs. Identify product or technology, or process margin related problem. Work with business unit, developer and unit process to improve stability, yield, cost and quality.
• Deviation lot assessment & disposition to ensure quality of products delivered to customers meet quality and reliability standard. Provide expert knowledge on risk assessment on product quality and reliability
• Drive fast feedback to production line in case of deviation, dentification of source and fast feedback and subsequently pursue for the prevention. Lead 8D.
• Lead/support technology synchronization, maintenance of technology FMEA
• Support and provide containment and improvement plan for customer issue.
• Lead technical topics across functional, cross technologies.

Responsibilities Process Integration

• Perform DOE splits for process margin study and improvement to improve technology/product performance
• Own wafer fab performance indicator e.g. fab yield, PCM, inline and DD stability.

Responsibilities Product Engineering

• Own wafer test performance e.g. wafer function test yield
• Act as an interface between Front End and Back End on yield, quality and reliability improvement topics
• Interface with business unit on product spec issue

Your Profile

Qualifications and skills to help you succeed:

• Phd, master’s or bachelor’s Degree in the Physics / Device Physics / Semiconductor device / Wafer Fabrication / Material Science / Engineering in Micro Electronic / Electronic / Electrical / Material / Chemical
• Excellent knowledge of semiconductor device physics/wafer fabrication process & passionate in technical on semiconductor devices
• In depth knowledge in all type of analysis and problem-solving methodologies e.g. 8D, SPC, FMEA, Six Sigma & DOE.
• Strong communication skills, able to interact with all levels of personnel
• Able to drive and lead improvement projects.
• Minimum 5 years of working experience in Semiconductor industry preferred
• Candidates with direct fab experience in Process Integration/Yield Enhancement/Product Engineering/Technology Development will have an added advantage

Equal Opportunity Statement: We embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities.