Senior SMT Process Dev for High-Complexity PCBs

Advanced Micro Devices, Inc.; Bayan Lepas; On-site; MYR 223,000 - 424,000; Full time

Benefits offered by this job

AMD benefits

Job summary

Advanced Micro Devices, Inc. in Penang, Malaysia seeks a senior SMT process development expert to lead end-to-end assembly strategies for high-complexity boards, owning large BGA packaging challenges and defining robust process controls with manufacturers worldwide.

You will apply DOE, statistical analysis, and IPC/J-STD standards to improve yield and reliability, collaborating across package, PCB, thermal, and manufacturing teams.

Qualifications

• Hands-on SMT process development from engineering builds to high-volume manufacturing.
• Experience with large BGAs and high warpage; warpage measurement methods.
• Familiarity with IPC/J-STD standards and board-level reliability qualification.
• Experience with global EMS partners and equipment vendors.

Responsibilities

• Lead end-to-end SMT process development (stencil/printing, placement, reflow, post-reflow) and define robust process windows for yield, reliability and scale.
• Own assembly of large, high-warpage BGA packages and derive design rules and controls.
• Reduce solder defects through stencil design, paste/flux selection and reflow optimization.
• Define edge bonding and underfill strategies for reliability and manufacturability.
• Evaluate mechanical stress transfer to solder joints and ensure repeatable BGA rework processes.
• Lead DFM reviews and author board-assembly guidelines for internal teams and EMS partners.
• Run DOEs and root-cause analysis for complex yield issues; explore new technologies.
• Collaborate with contract manufacturers, material suppliers and equipment vendors.

Skills

SMT process development

DOE

Root-cause analysis

Statistical methods

Education

Bachelor's or Master's in Manufacturing/Mechanical/Materials Science

Tools

Mentor Graphics

Cadence Allegro

Pentalogix

Job description

Advanced Micro Devices, Inc. in Penang, Malaysia seeks a senior SMT process development expert to lead end-to-end assembly strategies for high-complexity boards, owning large BGA packaging challenges and defining robust process controls with manufacturers worldwide.

You will apply DOE, statistical analysis, and IPC/J-STD standards to improve yield and reliability, collaborating across package, PCB, thermal, and manufacturing teams.