Senior Substrate Packaging Engineer – Lead Advanced Tech

Advanced Micro Devices, Inc; Penang; On-site; MYR 180,000 - 260,000; Full time

Benefits offered by this job

AMD benefits at a glance

Job summary

Advanced Micro Devices, Inc. (AMD) in Penang, Malaysia seeks a lead for technology development and supply chain bring up of advanced substrate technologies to support the AMD roadmap.

You will collaborate with architects, designers and partners to define high-yield substrate solutions and qualify new packages for cost and yield targets. The role requires hands-on process development in packaging, with strong communication skills for cross-functional teams and global suppliers.

Qualifications

• The candidate should have a hands-on approach to new process development with deep knowledge of packaging and board design rules, process flows and materials.
• Hands-on development experience in advanced substrate technologies at a substrate supplier, OSAT or Fabless/IDM.
• Excellent oral and written communication to communicate ideas and target requirements with suppliers, internal partners and AMD management.
• BS, MS or PhD in Physics, Chemistry, Materials Science, Chemical Engineering or equivalent.

Responsibilities

• Define advanced substrate and board technology roadmap across pitch scaling, power delivery, signal integrity and cost vectors.
• Partner with AMD architects, designers, and product owners to define high yielding, cost effective substrate solutions which meet product requirements.
• Select development partners to bring into AMD supply chain to enable industry leading substrate and PCB technology building blocks.
• Partner with product, quality and manufacturing engineering teams to meet milestones for manufacturability, yield and reliability from concept through NPI.
• Qualify package substrates of new products meeting cost and yield targets.

Skills

Packaging technology

Board design rules

Cross-functional leadership

Communication skills

Education

Degree in Physics / Chemistry / Materials Science / Chemical Engineering

Job description

Advanced Micro Devices, Inc. (AMD) in Penang, Malaysia seeks a lead for technology development and supply chain bring up of advanced substrate technologies to support the AMD roadmap.

You will collaborate with architects, designers and partners to define high-yield substrate solutions and qualify new packages for cost and yield targets. The role requires hands-on process development in packaging, with strong communication skills for cross-functional teams and global suppliers.