Senior IC Package Design Engineer (Penang)

Advanced Micro Devices, Inc.; Bayan Lepas; On-site; MYR 180,000 - 300,000; Full time

Job summary

Advanced Micro Devices, Inc. in Penang, Malaysia, seeks a Senior/Staff Package Design Engineer to own advanced IC package design from concept to tape-out, coordinating with SI, PI, thermal, and manufacturing teams.

You will drive substrate design, I/O planning, and DFX, ensuring electrical, mechanical, thermal targets and cost efficiency for high-speed interfaces like LPDDR5X/LPDDR6, PCIe, and die-to-die links.

Qualifications

• 5–10 years of IC or package design experience.
• Experience with high-speed interfaces (LPDDR, PCIe, SerDes).
• Strong substrate design flow knowledge (Cadence APD/SIP, Allegro).
• Experience in bump/ball map planning, layer stack‑up, and design rule management.
• Familiarity with manufacturing constraints and materials.
• Excellent problem-solving and cross-functional collaboration.
• Basic scripting for design automation is a plus.

Responsibilities

• Execute package substrate design from concept through production release.
• Partner with AMD architects and product owners to define high yielding, cost effective substrate solutions.
• Define and implement package architecture based on electrical, thermal, and mechanical requirements.
• Work with chip, board, and system teams to optimize I/O planning, bump/ball assignments, and interface SI/PI.
• Conduct design feasibility studies and trade-offs for performance, cost, and reliability.
• Drive DFX (Design for Manufacturability, Assembly, and Test) into the package design process.
• Perform modelling extraction for SI/PI analysis, including high-speed interfaces and PDN impedance.
• Collaborate with SI, PI, and thermal teams to ensure robust performance.
• Interface with substrate suppliers to define design rules, stack-ups, and materials.
• Contribute to design automation and flow improvements, scripting, and methodology development.

Skills

Package design

IC packaging

High-speed interfaces

DFX

Signal integrity

Power integrity

Thermal analysis

Scripting

Education

Bachelor’s or Master’s degree in Electrical Engineering

Tools

Cadence APD/SIP

Allegro

Ansys HFSS

Sigrity

Job description

Advanced Micro Devices, Inc. in Penang, Malaysia, seeks a Senior/Staff Package Design Engineer to own advanced IC package design from concept to tape-out, coordinating with SI, PI, thermal, and manufacturing teams.

You will drive substrate design, I/O planning, and DFX, ensuring electrical, mechanical, thermal targets and cost efficiency for high-speed interfaces like LPDDR5X/LPDDR6, PCIe, and die-to-die links.