Senior SMT Process Architect for High-Complexity PCBs

Advanced Micro Devices, Inc.; George Town; On-site; MYR 120,000 - 180,000; Full time

Benefits offered by this job

AMD benefits

Job summary

Advanced Micro Devices, Inc. in Penang, Malaysia, seeks a senior technical expert in SMT and board-assembly process development for high-complexity computing platforms.

You will define assembly strategies, influence product design and make complex PCB assemblies manufacturable, especially large BGA packages. You are a hands-on authority who communicates clearly across package, PCB, thermal and manufacturing teams, leading end-to-end process development and collaborating with EMS partners to

Qualifications

• Hands-on SMT process development experience for high-complexity PCB assemblies.
• Experience with large BGAs and warpage measurement/inspection.
• Strong knowledge of DOE and root-cause analysis methods.

Responsibilities

• Lead end-to-end SMT process development (stencil/printing, placement, reflow, post-reflow) and define robust process windows for yield, reliability and scale.
• Own assembly of large, high-warpage BGA packages and translate warpage data into design rules and fixtures.
• Reduce solder defects through stencil design, paste/flux selection and reflow optimization.
• Define edge bonding/underfill strategies to improve mechanical reliability and integrate heatsinks and thermal materials.
• Evaluate mechanical stress transfers to solder joints and ensure repeatable post-SMT rework processes.
• Lead DFM reviews and author board-assembly guidelines for internal teams and EMS partners.
• Run DOEs and root-cause analyses for complex yield/reliability issues; explore new tech such as low-temp solder.
• Collaborate with contract manufacturers, material suppliers and vendors to qualify capabilities.

Skills

SMT process

Large BGA

DOE analysis

IPC standards

EMS partners

PCB CAD tools

Education

Bachelor's or Master's in Engineering/Materials Science

Job description

Advanced Micro Devices, Inc. in Penang, Malaysia, seeks a senior technical expert in SMT and board-assembly process development for high-complexity computing platforms.

You will define assembly strategies, influence product design and make complex PCB assemblies manufacturable, especially large BGA packages. You are a hands-on authority who communicates clearly across package, PCB, thermal and manufacturing teams, leading end-to-end process development and collaborating with EMS partners to