Senior SMT Process Engineer – NPI & Warpage Specialist

SANMINA-SCI SYSTEMS (MALAYSIA) SDN BHD; Seberang Perai; On-site; MYR 120,000 - 180,000; Full time

Job summary

Sanmina Corporation Malaysia is seeking a highly independent Senior or Principal Process Engineer to lead SMT and SOM package development, NPI builds, and DOE execution for advanced PCBA assemblies, aiming for high yield, quality and reliability.

The role requires strong SMT process knowledge, Shadow Moiré analysis for warpage, planning and interpreting DOE, cross-functional coordination, and meticulous PFMEA/Control Plan documentation.

Qualifications

• Strong SMT process fundamentals: reflow profiling, stencil design, solder paste rheology, AOI/SPC control.
• Experience in Shadow Moiré warpage analysis and interpreting thermal co-planarity results.
• Skilled in DOE, SPC, CPK, and structured problem-solving methodologies (DMAIC, 5-Why, Fishbone).

Responsibilities

• Lead SMT process development, optimization, and qualification for SOM and complex PCBA assemblies.
• Plan, execute, and interpret Design of Experiments (DOE) to establish robust process windows.
• Drive NPI builds from prototype to mass production, ensuring full process readiness and documentation compliance.
• Define, verify, and control critical process parameters such as stencil design, paste selection, and reflow profile optimization.
• Perform and analyze Shadow Moiré testing to assess package warpage and thermal deformation impact on assembly yield.
• Coordinate with design, material, and quality teams to troubleshoot and implement process improvements.
• Conduct DFM/DFT reviews, void reduction trials, and co-planarity control for advanced packaging.
• Maintain accurate PFMEA, Control Plan, Process Flow, and Work Instruction documentation.
• Evaluate and qualify materials, solder pastes, fluxes, and SMT equipment in accordance with IPC/JEDEC standards.
• Ensure all assigned activities are completed independently, responsibly, and within project timelines.

Skills

SMT process knowledge

Shadow Moiré analysis

DOE execution

SPC/CPK

Process documentation

Education

Bachelor's Degree in Electronics/Manufacturing/Mechanical Engineering

Tools

Shadow Moiré equipment

IPC/JEDEC standards

Job description

Sanmina Corporation Malaysia is seeking a highly independent Senior or Principal Process Engineer to lead SMT and SOM package development, NPI builds, and DOE execution for advanced PCBA assemblies, aiming for high yield, quality and reliability.

The role requires strong SMT process knowledge, Shadow Moiré analysis for warpage, planning and interpreting DOE, cross-functional coordination, and meticulous PFMEA/Control Plan documentation.