Senior QA Engineer

Carsem (M) Sdn. Bhd

Ipoh

On-site

MYR 60,000 - 100,000

Full time

14 days+

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Benefits offered by this job

Medical

Education support

Dental

Parking

Medical for immediate family

Car subsidy

Job summary

Carsem (M) Sdn. Bhd is seeking a Quality Engineering professional with 5–7 years of experience to lead customer complaint management, root cause analyses and CAPA implementation.

The role requires collaboration with Process Engineering, Manufacturing and Quality teams to resolve complex quality issues and support audits. The candidate will drive FMEA, SPC, 8D problem solving and ensure compliance with IATF 16949/ISO 9001 standards while contributing to continuous improvement initiatives within

Qualifications

Bachelor's degree in Engineering, Science or related discipline.
5–7 years of relevant Quality Engineering experience.
Strong experience in customer complaint management and structured problem-solving.
Detailed understanding and hands-on experience in 8D analysis.
Good understanding of IATF 16949 and/or VDA 6.3 requirements.
Experience in semiconductor assembly and packaging preferred.
Experience handling customer audits and quality-related customer engagements is an advantage.

Responsibilities

Act as the key interface with customers on quality complaints, including VOC and VOP matters.
Coordinate with internal teams to assess and resolve customer quality concerns.
Lead containment activities and risk assessments to minimize impact of quality issues.
Ensure timely communication with customers throughout the resolution process.
Coordinate cross-functional root cause analyses for customer complaints.
Drive development and implementation of CAPA with sustainable actions.
Manage FA activities and ensure timely customer submission and follow-up.
Support customer audits and internal audits to verify CAPA effectiveness.
Prepare quality reports for management review and support continuous improvement.
Ensure quality documentation complies with ISO 9001 and IATF 16949 standards.

Skills

Customer complaint management

Structured problem-solving

8D analysis

FMEA

SPC

IATF 16949 / ISO/TS 16949

Semiconductor assembly & packaging

Education

Bachelor's Degree in Engineering/Science

Job description

Act as the key interface with customers on quality-related complaints and issues, including Voice of Customer (VOC) and Voice of Process (VOP) matters.

Coordinate with relevant internal teams to understand, assess, and resolve customer quality concerns.

Lead containment activities and risk assessments to minimize the impact of quality issues.

Ensure timely and effective communication with customers throughout the complaint resolution process.

2. Root Cause Analysis & CAPA

Coordinate cross-functional teams to conduct structured root cause analysis for customer complaints and quality issues.

Drive the development and implementation of effective Corrective and Preventive Actions (CAPA).

Ensure corrective actions address the root cause and are sustainable to prevent recurrence.

Follow up on action plans and monitor their effectiveness until formal closure.

3. Failure Analysis & Customer RMA

Coordinate and follow up on Failure Analysis (FA) activities and submission to customers.

Manage customer Return Material Authorization (RMA) activities and ensure timely follow-up with relevant internal teams.

Review and consolidate technical findings and supporting information for customer submission.

4. Customer & Internal Audit

Support and coordinate customer audits, including preparation, audit execution, and follow-up on findings.

Work with relevant functions to ensure customer audit findings are addressed within the agreed timeline.

Conduct internal audits to verify the effectiveness and closure of CAPA.

Ensure quality activities and processes are aligned with applicable IATF 16949 requirements.

5. Quality Reporting & Management Review

Prepare and consolidate quality-related reports for management review.

Analyse customer complaints, quality trends, and recurring issues to identify areas requiring improvement.

Provide relevant quality data and recommendations to management and stakeholders.

6. Quality System & Continuous Improvement

Support the implementation and maintenance of quality management system requirements.

Participate in continuous improvement initiatives to strengthen process quality and reduce recurring quality issues.

Ensure appropriate quality documentation and records are maintained.

7. Cross-Functional Collaboration

Work closely with Process Engineering, Manufacturing, Quality, Reliability, and other relevant functions to resolve customer and process-related quality issues.

Provide technical input and quality guidance during problem-solving and improvement activities.

Support other quality-related activities or projects as assigned by the QA Manager.

Qualifications & Experience

Education

Bachelor's Degree in Engineering, Science, or a related discipline.

5–7 years of relevant experience in Quality Engineering.

Strong experience in customer complaint management and structured problem-solving.

Detailed understanding and hands‑on experience in 8D analysis.

Good understanding of IATF 16949 and/or VDA 6.3 requirements.

Experience in semiconductor assembly and packaging is preferred.

Experience in handling customer audits and quality-related customer engagements would be an advantage.

Technical & Professional Knowledge

Failure Mode and Effects Analysis (FMEA)

Statistical Process Control (SPC)

8D Problem Solving

Control Plans

Reliability and Quality Systems

ISO 9001

IATF 16949 / ISO/TS 16949

Semiconductor assembly and test flow

Semiconductor packaging and manufacturing processes

Customer complaint and CAPA management

Unlock job insights

Hirer responsiveness Salary match Number of applicants

Consumer Electronics Manufacturing More than 10,000 employees

Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest range package & test portfolios in the world.

Founded in 1972, Carsem is among the most experienced companies in our industry and is recognized as one of the largest in unit volume production. We have over 6,000 employees and ship in excess of 100 million units each week and more than 65% of this volume is shipped as fully tested product. Carsem is a member of one of South East Asia's most successful corporations, the Hong Leong Group, who views semiconductors as a core business.

We have three high technology factories. Two are located in Ipoh, Malaysia, and a new third factory is located in Suzhou, China. The two factories in Malaysia, Carsem - M Site and Carsem - S Site, are 10 miles (16Km) apart. Ipoh is a 90 minute drive from Penang and 2.5 hours from Kuala Lumpur.

The factories are supported by extensive R&D and failure analysis staff and incorporate highly sophisticated, "state of the art" automated equipment, ensuring quality products which meet the exacting standards of all the automotive, telecom, computer and consumer goods industries. Both factories maintain world-class quality standards having achieved ISO/TS 16949, ISO-9001, ISO-14001 certifications and comply to the Sony Green Partner Program. They are supported with a global network of sales and technical support offices. The China factory, Carsem-Suzhou Ltd., is located in the province of Jiangsu, 50 miles (80Km) west of Shanghai. The new factory is 172K sq. ft. (16K sq. m.) and is on 645K sq. ft. (60K sq. m.) of land in the Suzhou Industrial Park. The construction was completed in January 2004, the staff has been through extensive training in Carsem's existing Malaysian factories and the assembly and test equipment to support the manufacture of the MLP (Micro Leadframe Package) Quad and Dual was installed during the second quarter of 2004. Customer qualifications were completed during the second quarter and the factory started shipping production volumes during the third quarter of 2004.

Product & Services

Product Groups Assembled at M Site: MLP MICRO I.C. PDIP (300/600 Mil), PLCC, SOIC (150Mil), MSOP (3.0mm), QSOP (150Mil) MICRO SOT 23, SOT66x, TSOT, SOT, TO92; SC 70 POWER TO220, DDPAK, SOT223 S Site

S Site commenced operations in April,1992. The factory has a total floor space of 384,000 sq. ft. (35,700 M2), a work force of 4,300 employees and the ability to expand by 270,000 sq. ft. (25,000 M2) in the future. Product Groups Assembled at S Site: MLP QUAD, DUAL ARRAY SSBGA, SSLGA, FTBGA, CBGA I.C. PDIP (300 Mil), PLCC, SOIC (150/300 Mil), QSOP (300 Mil), SSOP (5.3mm), TSSOP (4.4/ 6.1mm) QFP MQFP, LQFP, TQFP SiP System in Package

Other Information

VISION

"To be a World Class Company Offering Assembly, Test/Finishing Solutions to Semiconductor Companies Throughout the World"

MISSION

"Carsem will Continue to show Profitable Growth with Emphasis on Employee Development and Operational and Service Indices to Ensure that we are the Employer Of Choice and Supplier Of Choice"

QUALITY

Carsem's policy is to provide products and services of the highest quality through "ZERO DEFECTS TODAY!", preventive Quality culture. Employees will act with honesty, sincerity and operate as a team to continuously strive for improvements in quality, productivity, delivery, services and cost in order to be competitive and profitable. ZERO DEFECTS QUALITY is the responsibility of every employee.

PERSONAL DATA PROTECTION

The Hong Leong Group use personal data in accordance with the Hong Leong Group Privacy Notice for new applicants which can be found (http://www.hongleong.com.my).